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LCD TV
SERVICE MANUAL
CAUTION
BEFORE SERVICING THE CHASSIS,
READ THE SAFETY PRECAUTIONS IN THIS MANUAL.
CHASSIS : LP91A
MODEL : 26LH20R 26LH20R-MA
North/Latin America http://aic.lgservice.com
Europe/Africa http://eic.lgservice.com
Asia/Oceania http://biz.lgservice.com
Internal Use Only
Copyright LG Electronics. Inc. All right reserved. 
Only for training and service purposes
LGE Internal Use Only- 2 -
CONTENTS
CONTENTS .............................................................................................. 2
PRODUCT SAFETY ..................................................................................3
SPECIFICATION ........................................................................................6
ADJUSTMENT INSTRUCTION................................................................11
TROUBLE SHOOTING ............................................................................16
BLOCK DIAGRAM...................................................................................19
EXPLODED VIEW .................................................................................. 20
SVC. SHEET ...............................................................................................
Copyright LG Electronics. Inc. All right reserved. 
Only for training and service purposes
LGE Internal Use Only- 3 -
SAFETY PRECAUTIONS
Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the
Schematic Diagram and Exploded View.
It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent
Shock, Fire, or other Hazards. 
Do not modify the original design without permission of manufacturer.
General Guidance
An isolation Transformer should always be used during the
servicing of a receiver whose chassis is not isolated from the AC
power line. Use a transformer of adequate power rating as this
protects the technician from accidents resulting in personal injury
from electrical shocks.
It will also protect the receiver and it's components from being
damaged by accidental shorts of the circuitry that may be
inadvertently introduced during the service operation.
If any fuse (or Fusible Resistor) in this TV receiver is blown,
replace it with the specified.
When replacing a high wattage resistor (Oxide Metal Film Resistor,
over 1W), keep the resistor 10mm away from PCB.
Keep wires away from high voltage or high temperature parts.
Before returning the receiver to the customer,
always perform an AC leakage current check on the exposed
metallic parts of the cabinet, such as antennas, terminals, etc., to
be sure the set is safe to operate without damage of electrical
shock. 
Leakage Current Cold Check(Antenna Cold Check)
With the instrument AC plug removed from AC source, connect an
electrical jumper across the two AC plug prongs. Place the AC
switch in the on position, connect one lead of ohm-meter to the AC
plug prongs tied together and touch other ohm-meter lead in turn to
each exposed metallic parts such as antenna terminals, phone
jacks, etc. 
If the exposed metallic part has a return path to the chassis, the
measured resistance should be between 1MΩ and 5.2MΩ. 
When the exposed metal has no return path to the chassis the
reading must be infinite.
An other abnormality exists that must be corrected before the
receiver is returned to the customer.
Leakage Current Hot Check (See below Figure) 
Plug the AC cord directly into the AC outlet.
Do not use a line Isolation Transformer during this check.
Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor
between a known good earth ground (Water Pipe, Conduit, etc.)
and the exposed metallic parts.
Measure the AC voltage across the resistor using AC voltmeter
with 1000 ohms/volt or more sensitivity.
Reverse plug the AC cord into the AC outlet and repeat AC voltage
measurements for each exposed metallic part. Any voltage
measured must not exceed 0.75 volt RMS which is corresponds to
0.5mA.
In case any measurement is out of the limits specified, there is
possibility of shock hazard and the set must be checked and
repaired before it is returned to the customer.
Leakage Current Hot Check circuit
1.5 Kohm/10W
To Instrument’s
exposed 
METALLIC PARTS
Good Earth Ground
such as WATER PIPE,
CONDUIT etc.
AC Volt-meter
When 25A is impressed between Earth and 2nd Ground
for 1 second, Resistance must be less than 0.1
*Base on Adjustment standard
IMPORTANT SAFETY NOTICE
0.15uF
Ω
Copyright LG Electronics. Inc. All right reserved. 
Only for training and service purposes
LGE Internal Use Only- 4 -
CAUTION: Before servicing receivers covered by this service
manual and its supplements and addenda, read and follow the
SAFETY PRECAUTIONS on page 3 of this publication.
NOTE: If unforeseen circumstances create conflict between the
following servicing precautions and any of the safety precautions on
page 3 of this publication, always follow the safety precautions.
Remember: Safety First.
General Servicing Precautions
1. Always unplug the receiver AC power cord from the AC power
source before;
a. Removing or reinstalling any component, circuit board
module or any other receiver assembly.
b. Disconnecting or reconnecting any receiver electrical plug or
other electrical connection.
c. Connecting a test substitute in parallel with an electrolytic
capacitor in the receiver.
CAUTION: A wrong part substitution or incorrect polarity
installation of electrolytic capacitors may result in an
explosion hazard.
2. Test high voltage only by measuring it with an appropriate high
voltage meter or other voltage measuring device (DVM,
FETVOM, etc) equipped with a suitable high voltage probe.
Do not test high voltage by "drawing an arc".
3. Do not spray chemicals on or near this receiver or any of its
assemblies.
4. Unless specified otherwise in this service manual, clean
electrical contacts only by applying the following mixture to the
contacts with a pipe cleaner, cotton-tipped stick or comparable
non-abrasive applicator; 10% (by volume) Acetone and 90% (by
volume) isopropyl alcohol (90%-99% strength)
CAUTION: This is a flammable mixture.
Unless specified otherwise in this service manual, lubrication of
contacts in not required.
5. Do not defeat any plug/socket B+ voltage interlocks with which
receivers covered by this service manual might be equipped.
6. Do not apply AC power to this instrument and/or any of its
electrical assemblies unless all solid-state device heat sinks are
correctly installed.
7. Always connect the test receiver ground lead to the receiver
chassis ground before connecting the test receiver positive
lead.
Always remove the test receiver ground lead last.
8. Use with this receiver only the test fixtures specified in this
service manual.
CAUTION: Do not connect the test fixture ground strap to any
heat sink in this receiver.
Electrostatically Sensitive (ES) Devices
Some semiconductor (solid-state) devices can be damaged easily
by static electricity. Such components commonly are called
Electrostatically Sensitive (ES) Devices. Examples of typical ES
devices are integrated circuits and some field-effect transistors and
semiconductor "chip" components. The following techniques
should be used to help reduce the incidence of component
damage caused by static by static electricity.
1. Immediately before handling any semiconductor component or
semiconductor-equipped assembly, drain off any electrostatic
charge on your body by touching a known earth ground.
Alternatively, obtain and wear a commercially available
discharging wrist strap device, which should be removed to
prevent potential shock reasons prior to applying power to the
unit under test.
2. After removing an electrical assembly equipped with ES
devices, place the assembly on a conductive surface such as
aluminum foil, to prevent electrostatic charge buildup or
exposure of theassembly.
3. Use only a grounded-tip soldering iron to solder or unsolder ES
devices.
4. Use only an anti-static type solder removal device. Some solder
removal devices not classified as "anti-static" can generate
electrical charges sufficient to damage ES devices.
5. Do not use freon-propelled chemicals. These can generate
electrical charges sufficient to damage ES devices.
6. Do not remove a replacement ES device from its protective
package until immediately before you are ready to install it.
(Most replacement ES devices are packaged with leads
electrically shorted together by conductive foam, aluminum foil
or comparable conductive material).
7. Immediately before removing the protective material from the
leads of a replacement ES device, touch the protective material
to the chassis or circuit assembly into which the device will be
installed.
CAUTION: Be sure no power is applied to the chassis or circuit,
and observe all other safety precautions.
8. Minimize bodily motions when handling unpackaged
replacement ES devices. (Otherwise harmless motion such as
the brushing together of your clothes fabric or the lifting of your
foot from a carpeted floor can generate static electricity
sufficient to damage an ES device.)
General Soldering Guidelines
1. Use a grounded-tip, low-wattage soldering iron and appropriate
tip size and shape that will maintain tip temperature within the
range or 500°F to 600°F.
2. Use an appropriate gauge of RMA resin-core solder composed
of 60 parts tin/40 parts lead.
3. Keep the soldering iron tip clean and well tinned.
4. Thoroughly clean the surfaces to be soldered. Use a mall wire-
bristle (0.5 inch, or 1.25cm) brush with a metal handle.
Do not use freon-propelled spray-on cleaners.
5. Use the following unsoldering technique
a. Allow the soldering iron tip to reach normal temperature.
(500°F to 600°F)
b. Heat the component lead until the solder melts.
c. Quickly draw the melted solder with an anti-static, suction-
type solder removal device or with solder braid.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
6. Use the following soldering technique.
a. Allow the soldering iron tip to reach a normal temperature
(500°F to 600°F)
b. First, hold the soldering iron tip and solder the strand against
the component lead until the solder melts.
c. Quickly move the soldering iron tip to the junction of the
component lead and the printed circuit foil, and hold it there
only until the solder flows onto and around both the
component lead and the foil.
CAUTION: Work quickly to avoid overheating the circuit
board printed foil.
d. Closely inspect the solder area and remove any excess or
splashed solder with a small wire-bristle brush.
SERVICING PRECAUTIONS
Copyright LG Electronics. Inc. All right reserved. 
Only for training and service purposes
LGE Internal Use Only- 5 -
IC Remove/Replacement
Some chassis circuit boards have slotted holes (oblong) through
which the IC leads are inserted and then bent flat against the
circuit foil. When holes are the slotted type, the following technique
should be used to remove and replace the IC. When working with
boards using the familiar round hole, use the standard technique
as outlined in paragraphs 5 and 6 above.
Removal
1. Desolder and straighten each IC lead in one operation by gently
prying up on the lead with the soldering iron tip as the solder
melts.
2. Draw away the melted solder with an anti-static suction-type
solder removal device (or with solder braid) before removing the
IC.
Replacement
1. Carefully insert the replacement IC in the circuit board.
2. Carefully bend each IC lead against the circuit foil pad and
solder it.
3. Clean the soldered areas with a small wire-bristle brush.
(It is not necessary to reapply acrylic coating to the areas).
"Small-Signal" Discrete Transistor
Removal/Replacement
1. Remove the defective transistor by clipping its leads as close as
possible to the component body.
2. Bend into a "U" shape the end of each of three leads remaining
on the circuit board.
3. Bend into a "U" shape the replacement transistor leads.
4. Connect the replacement transistor leads to the corresponding
leads extending from the circuit board and crimp the "U" with
long nose pliers to insure metal to metal contact then solder
each connection.
Power Output, Transistor Device
Removal/Replacement
1. Heat and remove all solder from around the transistor leads.
2. Remove the heat sink mounting screw (if so equipped).
3. Carefully remove the transistor from the heat sink of the circuit
board.
4. Insert new transistor in the circuit board.
5. Solder each transistor lead, and clip off excess lead.
6. Replace heat sink.
Diode Removal/Replacement
1. Remove defective diode by clipping its leads as close as
possible to diode body.
2. Bend the two remaining leads perpendicular y to the circuit
board.
3. Observing diode polarity, wrap each lead of the new diode
around the corresponding lead on the circuit board.
4. Securely crimp each connection and solder it.
5. Inspect (on the circuit board copper side) the solder joints of
the two "original" leads. If they are not shiny, reheat them and if
necessary, apply additional solder.
Fuse and Conventional Resistor
Removal/Replacement
1. Clip each fuse or resistor lead at top of the circuit board hollow
stake.
2. Securely crimp the leads of replacement component around
notch at stake top.
3. Solder the connections.
CAUTION: Maintain original spacing between the replaced
component and adjacent components and the circuit board to
prevent excessive component temperatures.
Circuit Board Foil Repair
Excessive heat applied to the copper foil of any printed circuit
board will weaken the adhesive that bonds the foil to the circuit
board causing the foil to separate from or "lift-off" the board. The
following guidelines and procedures should be followed whenever
this condition is encountered.
At IC Connections
To repair a defective copper pattern at IC connections use the
following procedure to install a jumper wire on the copper pattern
side of the circuit board. (Use this technique only on IC
connections).
1. Carefully remove the damaged copper pattern with a sharp
knife. (Remove only as much copper as absolutely necessary).
2. carefully scratch away the solder resist and acrylic coating (if
used) from the end of the remaining copper pattern.
3. Bend a small "U" in one end of a small gauge jumper wire and
carefully crimp it around the IC pin. Solder the IC connection.
4. Route the jumper wire along the path of the out-away copper
pattern and let it overlap the previously scraped end of the good
copper pattern. Solder the overlapped area and clip off any
excess jumper wire.
At Other Connections
Use the following technique to repair the defective copper pattern
at connections other than IC Pins. This technique involves the
installation of a jumper wire on the component side of the circuit
board.
1. Remove the defective copper pattern with a sharp knife.
Remove at least 1/4 inch of copper, to ensure that a hazardous
condition will not exist if the jumper wire opens.
2. Trace along the copper pattern from both sides of the pattern
break and locate the nearest component that is directly
connected to the affected copper pattern.
3. Connect insulated 20-gauge jumper wire from the lead of the
nearest component on one side of the pattern break to the lead
of the nearest component on the other side.
Carefully crimp and solder the connections.
CAUTION: Be sure the insulated jumper wire is dressed so the
it does not touch components or sharp edges.
Copyright LG Electronics. Inc. All right reserved. 
Only for training and service purposes
LGE Internal Use Only- 6 -
SPECIFICATION
NOTE : Specifications and others are subject to change without notice for improvement.
4. Electrical specification
4.1 General Specification
1. Application range
This spec sheet is applied to LCD TV used LP91A chassis.
2. SpecificationEach part is tested as below without special appointment.
1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC
2) Relative Humidity : 65±10%
3) Power Voltage : Standard input voltage(100~240V@50/60Hz)
* Standard Voltage of each products is marked by models.
4) Specification and performance of each parts are followed
each drawing and specif ication by part number in
accordance with BOM.
5) The receiver must be operated for about 5 minutes prior to
the adjustment.
3. Test method
1) Performance: LGE TV test method followed 
2) Demanded other specification 
- Safety: CE, IEC specification
- EMC : CE, IEC
No Item Specification Measurement Remark
1 Screen Size 26” wide Color Display Module Resolution: 1366*768
2 Aspect Ratio 16:9
3 LCD Module 26” TFT WXGA LCD HD
4 Operating Environment Temp.: 0 ~ 40 deg
Humidity : 0 ~ 80 %
5 Storage Environment Temp.: -20 ~ 60 deg
Humidity : 0~ 85 %
6 Input Voltage AC100-240V~, 50/60Hz
≤ 120 W 26” HD
7 LDC Module HD 626 x 373 x 44.1 with inverter
(Maker : LGD) 0.1405 x 0.4215
12 EEFL
Coating 3H
Copyright LG Electronics. Inc. All right reserved. 
Only for training and service purposes
No. Item Min. Typ. Max. Unit Maker Remark
1. Luminance 360 450 cd/m2
(W/O PC mode)
2. VIew angle (R/L, U/D) 178/ 178 degree LGD CR > 10
3. Color Coordinates White Wx Typ 0.279 Typ LGD 26”(HD)
Wy -0.03 0.292 +0.03 LC260WXN-SBA1
RED Xr 0.637
Yr 0.333
Green Xg 0.290
Yg 0.607
Blue Xb 0.145
Yb 0.061
4. Contrast ratio 700:1 1000:1 LGD 26”(HD)
5. Luminance Variation 1.3
- 7 - LGE Internal Use Only
5. Chroma& Brightness (Optical)
5.1. LCD Module
the Color Coordinates check condition 
- 50cm from the surface, Full White Pattern
- Picture mode Vivid
8. Component Video Input (Y, PB, PR)
No
Specification
Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I)
2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I)
3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz
4 720* 480 31.47 59.94 27.000 SDTV 480P
5 720* 480 31.50 60.00 27.027 SDTV 480P
6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz
7 1280* 720 44.96 59.94 74.176 HDTV 720P
8 1280* 720 45.00 60.00 74.250 HDTV 720P
9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz
10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz,
11 1920* 1080 33.72 59.94 74.176 HDTV 1080I
12 1920* 1080 33.75 60.00 74.25 HDTV 1080I
13 1920* 1080 56.25 50 148.5 HDTV 1080P
14 1920* 1080 67.432 59.94 148.350 HDTV 1080P
15 1920* 1080 67.5 60.00 148.5 HDTV 1080P
Copyright LG Electronics. Inc. All right reserved. 
Only for training and service purposes
- 8 - LGE Internal Use Only
No
Specification
Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 640* 350 31.468 70.09 25.17 EGA
2 720* 400 31.469 70.09 28.32 DOS
3 640* 480 31.469 59.94 25.17 VESA( VGA)
4 800* 600 37.879 60.317 40 VESA( SVGA)
5 1024* 768 48.363 60.004 65 VESA( XGA)
6 1280* 768 47.776 59.87 79.5 VESA( WXGA)
7 1360* 768 47.72 59.799 84.75 VESA( WXGA)
8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model
9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model
9. RGB 
9.1 Analog PC, RGB- DTV –NOT SUPPORT 
10. HDMI Input 
10.1 PC –Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable) 
No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark
1 640 x 480 31.469 59.94 25.17 VESA( VGA)
2 800 x 600 37.879 60.317 40.00 VESA( SVGA)
3 1024 x 768 48.363 60.004 65.00 VESA( XGA)
4 1280 x 768 47.776 59.87 79.5 VESA( WXGA)
5 1360 x 768 47.72 59.799 84.62 VESA( WXGA) 
6 1366 x 768 47.7 60.00 84.62 WXGA
7 1280 x 1024 63.595 60.00 108.875 SXGA
8 1920 x 1080 66.647 59.988 138.625 WUXGA
10.2 DTV Mode
No
Specification
Remark
Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz)
1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I)
2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) Spec. out
3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz but display.
4 720 x 480 31.47 59.94 27 SDTV 480P
5 720 x 480 31.5 60.00 27.027 SDTV 480P
6 720 x 576 31.25 50.00 27 SDTV 576P
7 1280 x 720 44.96 59.94 74.176 HDTV 720P
8 1280 x 720 45 60.00 74.25 HDTV 720P
9 1280 x 720 37.5 50.00 74.25 HDTV 720P
10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I
11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I
12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I
13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P
14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P
15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P
16 1920 x 1080 27 24.00 74.25 HDTV 1080P
17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P
1) Gap between Front Frame /Back cover and Middle Cabinet
2) Gap between Front Frame /Middle Cabinet
- 9 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. 
Only for training and service purposes
Top View 
Back Cover
Front Frame
Middle Cabinet
"b
"b
Gap b between Front Frame (Back cover) and Middle Cabinet
-> 0 † b † B (Side gap)
Gap a between Front Frame and Middle Cabine
-> 0 † a † A (Side gap)
"b
"a
Gap a between Front Frame and Middle Cabine
-> 0 † a † A (Left/ Right gap)
3) Gap between Back Cover and Side AV
Back View
Side View
Side AV
Back Cover
Gap f between Back Cover and Side AV
-> 0 † f † 1.0
Gap g between Back Cover and Side AV
-> 0 † g † 1.0
11. Mechical spec. 
No Item Min Typ Max Unit 
1. C/ A + B/ C top gap 0.5 1 1.5 mm
2. C/ A + B/ C side gap 0.5 1 1.5 mm
3. C/ A + Deco Front gap( ONE SIDE). 0.8 1 1.2 mm
*Active area
1. Active area of LCD PANEL is in bezel of cabinet
2. Interval between active area and bezel
|A-B|< 2.0 mm ,|C-D|< 2.0 mm
A:Interval between left of active area and bezel
B:Interval between right of active area and bezel
C:Interval between top of active area and bezel
D:Interval between bottom of active area and beze
4)Gap between Back Cover and Side AV
- 10 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. 
Only for training and service purposes
Side View "h"
Control Braket
Back Cover
Gap h between Back Cover and Control Bracket
-> 0 † h † 0.8
C
B
D
A
Active Area
Bezel
Copyright LG Electronics. Inc. All right reserved. 
Only for training and service purposes
LGE Internal Use Only- 11 -
ADJUSTMENT INSTRUCTION
1. Application Range
This specification sheet is applied to all of the LCD TV,
LP91A/B/C/D chassis.
2. Specification
1) Because this is not a hot chassis, it is not necessary to use
an isolation transformer. However, the use of isolation
transformer will help protect test instrument.
2) Adjustment must be done in the correct order.
3) The adjustment must be performed in the circumstance of
25 ±5 °C of temperature and 65±10% of relative humidity if
there is no specific designation.
4) The input voltage of the receiver must keep 100~220V,
50/60Hz.
5) Before adjustment, execute Heat-Run for 5 minutes at RF
no signal.
3. Adjustment items
3.1. PCB assembly adjustment items 
(1) Download the MSTAR main software
(IC800, Mstar ISP Utility)
1) Using D/L Jig
2) Using USB Memory Stick.
(2) ADC Calibration – RGB / Component
(3) Input Tool-Option/Area option.
(4) Check SW Version.
4. PCB assembly adjustment method
4.1. Mstar Main S/W program download
4.1.1. Using D/L Jig
(1) Preliminary steps
1) Connect the download jig to D-sub(RGB) jack
(2) Download steps
1) Execute ‘ISP Tool’ program, the main window(Mstar ISP
utility Vx.x.x) will be opened
2) Click the “Connect” button and confirm “Dialog Box”
3) Click the “Config.” button and Change speed I2C Speed
setting : 350Khz~400Khz
4) Read and write bin file.
Click “(1)Read” tab, and then load download
file(XXXX.bin) by clicking “Read”.
- LH20/ LH30
1
Filexxx.bin
1
Filexxx.bin
5) Click “(2)Auto” tab and set as below
6) Click “(3)Run”.
7) After downloading, you can see the “(4)Pass” message.
4.1.2. Using the Memory Stick
* USB download : Service Mode
1) Insert the USB memory stick to the ISB port.
2) Automatically detect the SW Version.-> S/W download process is executed automatically.
3) Show the message “Copy the file from the Memory”
4) After Finished the Download, Automatically DC Off -> On
5) Check The update SW Version.
4.2. Adjust tool/area option.
Adjust tool/area option refer to the BOM.
4.3. Adjust tool/area option.
Adjust tool/area option refer to the BOM.
4.4. EDID D/L method
Recommend that don’t connect HDMI and RGB(D-SUB) cable
when downloading the EDID.
If not possible, recommend that connect the MSPG equipment.
There are two methods of downloading the edid data
4.4.1. 1st Method
EDID datas are automatically downloaded when adjusting the
Tool Option2.
Automatically downloaded when pushing the enter key after
adjusting the tool option2.
It takes about 2seconds.
4.4.2. 2nd Method
* Caution :
Must be checked that the tool option is right or not. 
If tool option is wrong, hdmi edid data could not be
downloaded well.
1) Press the ADJ key
2) Move to the EDID D/L and Press the right direction key(G)
3) Press the right direction key(G) at Start.
4) After about a few seconds, appear “OK”, then compele.
4.4.3. RS-232C command Method
(1) Command : AE 00 10 
* Caution 
Don’t connect HDMI and RGB(D-SUB) cable when
downloading the EDID.
If the cables are connected, Downloading of edid could be
failed.
- 12 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. 
Only for training and service purposes
1
Filexxx.bin
 
 
4.4.4. EDID data
(1) HD MODEL 
<Analog(RGB): 128bytes>
<HDMI 1 : 256Bytes>
<HDMI 2 : 256Bytes>
4.5. ADC Calibration
4.5.1. ADC Calibration - Component (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to Component1 or 2 mode.
2) Input the Component 480i@60Hz 100% Color Bar
YPbPr signal into Component1 or 2.
(MSPG-925F Model: 209 / Pattern: 65 )
3) Press ADJ key on R/C for adjustment.
4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : Component” by using D/E
(CH +/-) and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
4.5.2. ADC Calibration - RGB (Using External pattern)
(1) Required Equipments
- Remote controller for adjustment
- MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator
(2) Process
1) Change the Input to RGB mode..
2) Input the PC 1024x768@60Hz Horizontal Color Bar
signal into RGB.
(MSPG-925F Model: 60 / Pattern: 65 ) 
3) Press ADJ key on R/C for adjustment.
4) Enter Password number. Password is “0 0 0 0”.
5) Select “0. ADC calibration : RGB” by using D/E(CH +/-)
and press ENTER(A).
6) ADC adjustment is executed automatically .
7) When ADC adjustment is finished, this OSD appear
- 13 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. 
Only for training and service purposes
OK
OK
4.6. Input Tool-Option, Area Option.
## TOOL Option, Area Option change and AC off
Before PCBA check, you have to change the Tool option,
Area option and have to AC off/on (Plug out and in)
(If missing this process, set can operate abnormally)
4.6.1. Profile
: Must be changed the option value because being different
with some setting value depend on module maker, inch and
market 
4.6.2. Equipment : adjustment remote control.
4.6.3. Adjustment method
The input methods are same as other chassis.(Use IN-START
Key on the Adjust Remocon.)
(If not changed the option, the input menu can differ the
model spec.)
* Refer to Job Expression of each main chassis ass’y
(EBTxxxxxxxx) for Option value 
* Never push the IN-STOP KEY after completing the function
inspection.
4.7. Check SW Version
(1) Method
1) Push In-star key on Adjust remote-controller.
2) SW Version check
Check “SW VER : V3.xx” – LH20
5. White Balance adjstment
5.1. Overview
(1) Purpose : Adjust the color temperature to reduce the
deviation of the module color temperature.
(2) Principle : To adjust the white balance without the
saturation, Fix the one of R/G/B gain to 192 (default data)
and decrease the others.
(3) Adjustment mode : Three modes – Cool / Medium / Warm
5.2. Required Equipment
(1) Remote controller for adjustment 
(2) Color Analyzer : CA100+ or CA-210 or same product -
LCD TV (ch:9)
(should be used in the calibrated ch by CS-1000)
(3) Auto W/B adjustment instrument(only for Auto adjustment)
5.3. Connecting diagram of equipment for
measuring (For automatic adjustment)
* LP91A~D Support RS-232C & I2C DDC Communication-White
Balance Mode.
(1) Enter the adjustment mode of DDC
- Set command delay time : 50ms
- Enter the DDC adjustment mode at the same time heat-
run mode when pushing the power on by power only key
- Maintain the DDC adjustment mode with same condition
of Heat-run => Maintain after AC off/on in status of Heat-
run pattern display)
(2) Release the DDC adjustment mode
- Release the adjust mode after AC off/on or std-by off/on
in status of finishing the Hear-run mode
- Release the Adjust mode when receiving the aging off
command(F3 00 00) from adjustment equipment.
- Need to transmit the aging off command to TV set after
finishing the adjustment.
- Check DDC adjust mode release by exit key and release
DDC adjust mode)
(3) Enter the adjust mode of white balance)
- Enter the white balance adjustment mode with aging
command (F3, 00, FF)
* Luminance min value is 150cd in the Cool/Medium/Warm
mode(For LCD)
5.3. Adjustment of White Balance (for Manual
adjustment)
(1) Color analyzer(CA100+, CA210) should be used in the
calibrated ch by CS-1000
(2) Operate the zero-calibration of the CA100+ or CA-210,
then stick sensor to the module when adjusting.
(3) For manual adjustment, it is also possible by the following
sequence.
1) Select white pattern of heat-run by pressing “POWER
ON” key on remote control for adjustment then operate
heat run longer than 15 minutes. (If not executed this
step, the condition for W/B may be different.)
2) Push “Exit” key.
3) Change to the AV mode by remote control.
4) Input external pattern (85% white pattern)
5) Push the ADJ key -> Enter “0000” (Password)
6) Select “3. W/B ADJUST”
7) Enter the W/B ADJUST Mode
8) Stick the sensor to the center of the screen and select
each items (Red/Green/Blue Gain and Offset) using
D/E(CH +/-) key on R/C..
9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C.
10) Adjust three modes all (Cool / Medium / Warm) : Fix
the one of R/G/B gain and change the others
11) When adjustment is completed, Enter “COPY ALL”.
12) Exit adjustment mode using EXIT key on R/C.
- 14 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. 
Only for training and service purposes
* CASE
First adjust the coordinate far away from the target value(x, y).
1. x, y > target
i) Decrease the R, G. 
2. x, y < target
i) First decrease the B gain, 
ii) Decrease the one of the others.
3. x > target, y < target
i) First decrease B, so make y a little more than the target.
ii) Adjust x value by decreasing the R
4. x < target, y > target
i) First decrease B, so make x a little more than the target.
ii) Adjust x value by decreasing the G
(4) Standard color coordinate and temperature when using the
CA100+ or CA210 equipment
To check the Coordinates of White Balance, you have to
measure at the below conditions.
Picture Mode : User 1
Dynamic Contrast : Off
Dynamic Colour : Off
(If you miss the upper condition, the coordinates of W/B
can be lower than the spec.)
- 15 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. 
Only for training and service purposes
Coordinate 
Mode 
x y 
Temp uv∆
Cool 0.276±0.002 0.283±0.002 11000K 0.000
Medium 0.285±0.002 0.293±0.002 9300K 0.000
Warm 0.313±0.002 0.329±0.002 6500K 0.003
Copyright LG Electronics. Inc. All right reserved. 
Only for training and service purposes
LGE Internal Use Only- 16 -
TROUBLESHOOTING
No power
(LED indicator off)
Check 24V, 12V, 5,2V 
of PowerB/D
Check short of Main B/D 
or Change Power B/D
Pass
Check Output of 
IC1001, IC1003, IC1007
Check P307 Connector 
Change LED Assy
: [A] PROCESS
Fail
Fail
Pass
Pass
Check LED Assy
Change IC1002,, Q1003
Pass
Check short of IC1001,
IC1003, IC1007
Fail
Re-soldering or Change defect
part of IC1001, IC1003, IC1007
Fail
No Raster [B]: Process
Check LED status
On Display Unit
Repeat A PROCESS
Pass
Fail
Check Output of IC802 Change IC802
Fail
Change Inverter Connector
Or InverterFail
Pass
Fail
Pass
Change Module
Fail
Check LVDS Cable
Pass
Check Panel Link Cable 
Or Module
Change Panel Link Cable
Or Module
Check Inverter Connector
Or Inverter
Pass
Copyright LG Electronics. Inc. All right reserved. 
Only for training and service purposes
LGE Internal Use Only- 17 -
No Raster on PC Signal
Check Input source Cable
and Jack
Pass
Re-soldering or 
Change the defect part
Pass
Check the Input/Output
Of IC100 Fail
Re-soldering or 
Change the defect part,
Check RGB EDID Data
Repeat [A], & [B] Process
Pass
Check the Input/Output
Of J104 Fail
Pass
Check the Input/Output
Of IC800 Fail
Re-soldering or 
Change the defect part
Pass
No Raster on COMMPONENT Signal
Check Input source 
Cable And Jack
Pass
Re-soldering or 
Change the defect part
Pass
Check the Input/Output
Of IC800 Fail
Re-soldering or 
Change the defect part
Repeat [A], & [B] Process
Check The Input/Output
Of JK101 Fail
Pass
No Raster on HDMI Signal
Check Input source 
Cable And Jack
Pass
Check the Input/Output
Of JK301, JK302, JK303 Fail
Re-soldering or 
Change the defect part
Pass
Pass
Check the Input/Output
Of IC300, IC301, JK302 Fail
Re-soldering or 
Change the defect part
Check HDMI EDID Data
Re-download HDCP
Pass
Pass
Check the Input/Output
Of IC800 Fail
Re-soldering or 
Change the defect part
Repeat [A], & [B] Process
Copyright LG Electronics. Inc. All right reserved. 
Only for training and service purposes
LGE Internal Use Only- 18 -
No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal
Check Input source 
Cable And Jack
Pass
Check Input source 
Cable And Jack
Pass
Check The Input/Output
Of JK101, JK201
Pass
Re-soldering or 
Change the defect part
Pass
Fail
Pass
Repeat [A], & [B] Process
Check the Input/Output
Of IC800 Fail
Re-soldering or 
Change the defect part
Pass
Check The Input/Output
Of TU500
Pass
Re-soldering or 
Change the defect part
Pass
Fail
Check the Input/Output
Of IC800 Fail
Re-soldering or 
Change the defect part
Repeat [A], & [B] Process
No Sound
Check The Input Sourse. 
Check The Input/Output
Of IC600.
Re-soldering or 
Change the defect part.Fail
Pass
Pass
Check The Speaker. Change Speaker.
Fail
Check The Speaker Wire.
Pass
Change The Source Input.
Fail
C
opyright LG
 E
lectronics. Inc. A
ll right reserved. 
O
nly for training and service purposes
LG
E
 Internal U
se O
nly
- 19
-
B
L
O
C
K
 D
IA
G
R
A
M
RGB_PC
PC_Audio
TV
(RF)
COMP1
HDMI1
HDMI2
RS232
TX
232C Driver
ST3232C
Tx/ Rx : 15Vpp
PC_R/ G/ B/ HS/ VS
PC_Audio_L/ R :700mVrms 
MNT_OUT: 1Vpp 
SIDE_V :1Vpp
SIDE_L/ SIDE_R :500mVrms
DDR2(512MB)
L_SPK_OUT 
R_SPK_OUT
EEPROM
24C02
Comp1_L/ R :500mVrms 
TUNER
AV1_VIN: 1Vpp
AV11_LIN/ RIN :500mVrms 
PWM
NTP3100L
MNT_OUT 
MNT_LOUT/ ROUT: 500mVrms
AV2
(Side AV) 
MAIN SCALER 
TXD / RXD : 5V Dig ital
COMP1_Y/ Pb/ Pr: 1/ 0.7Vpp
COMP2_Y/ Pb/ Pr: 1/0.7Vpp
IR
HDMI_DATA_1
HDMI_DATA_2
HDMI1_SCL/ SDA
OUT_E_TX_CLK
OUT_E_TX_E
OUT_E_TX_D
OUT_E_TX_C
OUT_E_TX_B
OUT_E_TX_A
TU_MAIN
S I F
COMP1_Y/ Pb/ Pr 1/ 0.7Vpp
AV1_VIN
PC_Audio_L/ R
COMP1_LIN/ RIN 
L_CH
R_CH
L
V
D
S
c
o
n
n
e
c
to
r
TU_MAIN
SUB_SCL SDA
EEPROM
24C02
EEPROM
24C02
SIF
AV1_LIN/ RIN 
MNT_L/ R OUT
AV1
MNT_OUT
Comp2_L/ R :500mVrms 
COMP2_Y/ Pb/ : 1/ 0.7Vpp
COMP2_LIN/ RIN 
COMP2
OUT_O_TX_CLK
OUT_O_TX_E
OUT_O_TX_D
OUT_O_TX_C
OUT_O_TX_B
OUT_O_TX_A
PC_R/ G/ B/ HS/ VS
HDM 2_SCL/ SDA
PC_SCL/ SDA
MNT_VOUT
AV2_VIN
AV2_LIN/ RIN 
IIS_OUT 
USB USB_DN/ PN
AUDIO
AMP
HDMI3_SCL/ SDAEEPROM
24C02
HDMI_DATA_3
TMDS
TMDS
TMDS
HDMI3
USB
For D/ L 
EEPROM(256K)
Serial Flash
(8MByte)
RGB_PC
PC_Audio
TV
(RF)
COMP1
HDMI1
HDMI2
RS232
TX
232C Driver
ST3232C
 –
PC_R/ G/ B/ HS/ VS
PC_Audio_L/ R :700mVrms 
MNT_OUT: 1Vpp 
SIDE_V :1Vpp
SIDE_L/ SIDE_R :500mVrms
DDR2(512MB)
 
EEPROM
24C02
Comp1_L/ R :500mVrms 
TUNER
AV1_VIN: 1Vpp
AV11_LIN/ RIN :500mVrms 
PWM
NTP3100L
MNT_OUT 
MNT_LOUT/ ROUT: 500mVrms
AV2
(Side AV) 
MAIN SCALER 
TXD / RXD : 5V Dig ital
COMP1_Y/ Pb/ Pr: 1/ 0.7Vpp
COMP2_Y/ Pb/ Pr: 1/0.7Vpp
HDMI_DATA_1
HDMI_DATA_2
_
OUT_E_TX_CLK–
OUT_E_TX_ –
OUT_E_TX_ –
OUT_E_TX_C–
OUT_E_TX_B–
OUT_E_TX_A–
TU_MAIN
S I F
COMP1_Y/ Pb/ P : 1/ 0.7Vpp
AV1_VIN
PC_Audio_L/ R
COMP1_LIN/ RIN 
L_CH
R_CH
L
V
D
S
c
o
n
n
e
c
to
r
TU_MAIN
/
EEPROM
24C02
EEPROM
24C02
SIF
AV1_LIN/ RIN 
MNT_L/ R OUT
AV1
MNT_OUT
Comp2_L/ R :500mVrms 
COMP2_Y/ Pb/Pr 1/ 0.7Vpp
COMP2_LIN/ RIN 
COMP2
OUT_O_TX_C –
OUT_O_TX_E–
OUT_O_TX_D–
OUT_O_TX_C–
OUT_O_TX_B–
OUT_O_TX_A–
PC_R/ G/ B/ HS/ VS
PC_SCL/ SDAPC_SCL/ SDA
MNT_VOUT
AV2_VIN
AV2_LIN/ RIN 
IIS_OUT 
USB USB_DN/ PN
AUDIO
AMP
HDMI3_SCL/ SDAHDMI3_SCL/ SDAEEPROM
24C02
HDMI_DATA_3
TMDS
TMDS
TMDS
HDMI3
USB
For D/ L 
EEPROM(256K)
Serial Flash
(8MByte)
C
opyright LG
 E
lectronics. Inc. A
ll right reserved. 
O
nly for training and service purposes
LG
E
 Internal U
se O
nly
- 20
-
300
200
200T
200N
800
804
540
803
805
400
900
510
310
500
120
121
802
801
550
530
E
X
P
L
O
D
E
D
 V
IE
W
M
any electrical and m
echanical parts in this chassis have special safety-related characteristics. T
hese
parts are identified by in the S
chem
atic D
iagram
 and E
X
P
LO
D
E
D
 V
IE
W
. 
It is e
sse
n
tia
l th
a
t th
e
se
 sp
e
cia
l sa
fe
ty p
a
rts sh
o
u
ld
 b
e
 re
p
la
ce
d
 w
ith
 th
e
 sa
m
e
 co
m
p
o
n
e
n
ts a
s
recom
m
ended in this m
anual to prevent X
-R
A
D
IA
T
IO
N
, S
hock, F
ire, or other H
azards. 
D
o not m
odify the original design w
ithout perm
ission of m
anufacturer.
IM
P
O
R
T
A
N
T
 S
A
F
E
T
Y
 N
O
T
IC
E
A2
LV1
A10
MULTI_PW_SW
10R859
56AR
81
2
SUB_SDA
HP
D_
M
ST
_3
+1.8V_DDR
COMP2_PB
RT1C3904-T112
Q802
E
BC
DDR2_DQM0
10
0
R
82
5
0.047uFC828
KE
Y1
RL
_O
N
MX25L6405DMI-12G
IC802
3 NC_1
2 VCC
4 NC_2
1 HOLD
6 NC_4
5 NC_3
7 CS
8 SO/SIO1 9WP/ACC
10GND
11NC_5
12NC_6
13NC_7
14NC_8
15SI.SIO0
16SCLK
0.01uF
C864
0.
1u
F
C
88
2
I2
S_
SC
K
TMDS2_RX2-0.1uFC833
I2
S_
M
CL
K
US
B_
DN
100R882
MAIN_SIF
PC_G
10
0
R
80
24
33R844
10
R
80
1
HD
M
I3
_S
ID
E
0.047uFC830
PA
NE
L_
ST
AT
US
TMDS2_RX0+
MNT_VOUT_T
TM
DS
3_
RX
0+
0.1uFC842
SW_RESET
RX
D
0 .01uF
C858
TMDS2_RX2+
+3.3V_MULTI_MST
0.
1u
F
C
81
3
12
M
Hz
X8
01
10R874
1MR
83
9
4 .7uF
C812
RL_ON
M_
SD
A
DD
C_
SD
A3
+3.3V_MULTI_MST
+3.3V_MST
MUTE_LINE
EEP_SCL
E-
DI
M
SIDE_RIN
10R862
56
AR805
DDR2_DQM1
10
R
84
8
HD
M
I3
_S
ID
E
EE
P_
SC
L
CE
C_
C
10uF
C866
0.01uF
C860
47R834
56AR
81
3
TM
DS
3_
RX
1+
SY
S_
RE
SE
T
SP
I_
C
Z
I2
S_
SD
O
0.1uFC815
22KR842
TMDS2_RXC+
DD
C_
SC
L1
0.047uFC837
PO
W
ER
_S
W
47R832
TMDS2_RXC-
+5VST_MST
0.1uFC848
56
AR810
10
R
84
1
HD
M
I3
_S
ID
E
0.1uFC838
+1.2V_VDDC_MST
+3.3V_MULTI_MST
JTP-1127WEM
SW800
1
2
43
MNT_L_AMP
0.1uF
C811
MNT_VOUT
DD
R2
_C
AS
Z
PANEL_ON
1000pFC835
0.1uFC849
PC_B
TM
DS
3_
RX
2+
+3.3V_MULTI_MST
0.047uFC829
DD
C_
SC
L3
DD
R2
_B
A1
DISP_EN/VAVS_ON
DD
R2
_R
AS
Z
DDR2_D[0-15]
TM
DS
3_
RX
0-
10R854
COMP2_Y
33AR
81
8
0.047uFC832
PC
_A
UD
_L
PC
_V
S
CV
BS
_L
IN
SPI_DI
402R807
READY
0.
1u
F
C
88
3
DD
R2
_B
A0
EEP_SCL
10
R
82
0
HD
M
I3
_S
ID
E
0 .01uF
C859
+3.3V_MULTI_MST
DDR2_DQS0M
SIDE_LIN
SIDE_V
0.047uFC831
0.01uF
C803
TMDS2_RX1+
+1.8V_DDR
DD
C_
SD
A1
SUB_SCL
DS
UB
_S
DA
10R890
100R881
CAT24WC08W-TIC803
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
DD
R2
_C
KE
+12V_AUDIO
SP
I_
CL
K
+3.3V_MULTI_MST
DDR2_DQS1M
0.01uF
C807
KDS181
D803
US
B_
DP
+3.3V_MST
10
0
R
80
25
+3.3V_MULTI_MST
56
AR809
I-D
IM
SPI_CZ
0.
1u
F
C
80
8
0.1uFC804
56
R
85
2IR
0.01uFC841
EE
P_
SD
A
DDR2_A[0-12]
+3.3V_MULTI_MST
10
R
82
2
HD
M
I3
_S
ID
E
CVBS_VIN
10R851
DDR2_DQS1P
10
R
82
3
HD
M
I3
_S
ID
E
TM
DS
3_
RX
C-
MNT_VOUT_T
TMDS2_RX0-
+3.3V_MULTI_MST
DDR2_DQS0P
10
R
82
1
HD
M
I3
_S
ID
E
10R869
47R837
DDR2_MCLKZ
DD
R2
_W
EZ
TX
D
56
AR806
0.047uFC834
EEP_SDA
TMDS1_RXC+
24LC256-I/SM
IC801
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
CO
M
P2
_R
M
_S
CL
+3.3V_MULTI_MST
PC
_H
S
TMDS1_RX2-
0.01uFC850
+3.3V_MULTI_MST
TM
DS
3_
RX
C+
47uF25V
C870
+3.3V_MULTI_MST
470R835
10R891
KDS181
D802
TV_MAIN
10
00
pF
C
81
8
COMP2_PR
RT1C3904-T112
Q804
NON 19_22"
E B
C
0.1uF
C867
22KR845
10
0
R
80
26
TM
DS
3_
RX
1-
P_24V_SMALL_15V
0.
01
uF
C
84
0
2.2uFC861
HPD_MST_1
10R873
10R880
SPI_DO
PC
_A
UD
_R
0.01uFC810
56AR
81
4
+1.2V_VDDC_MST
10
0
R
80
23
TMDS2_RX1-
DD
C_
SC
L2
10R858
10R892
TMDS1_RX1+
10R871
TMDS1_RX2+
EEP_SDA
56AR
80
0
10
R
80
5
HD
M
I3
_S
ID
E
KDS181
D801
DD
R2
_O
DT
TMDS1_RXC-
SP
I_
D
I
I2
S_
W
S
DDR2_MCLK
0.047uFC826
TMDS1_RX0-
10R872
MNT_R_AMP
10R879
HPD_MST_2
0.1uFC853
0.01uFC839
DS
UB
_S
CL
0 .01uF
C865
CO
M
P2
_L
10
uF
16
V
C
80
9
+1.8V_DDR
0.01uF
C862
+1.2V_VDDC_MST
TMDS1_RX1-
4.
7u
F
C
82
0
10
0
R
82
4
10
0
R
82
9
KE
Y2
56AR
81
5
TMDS1_RX0+
0.01uF
C857
CV
BS
_R
IN
2.2uFC856
0.1uFC869
+5VST_MST
0.1uF
C814
PC_R
SPI_CLK
33R843
0.
1u
F
C
84
4
10R856
TM
DS
3_
RX
2-
0.
01
uF
C
87
6
DD
C_
SD
A2
SP
I_
DO
P_12V_SMALL_15V
+5VST_MST
POWER_DET
PO
W
ER
_D
ET
RT1C3904-T112
Q803
E
B
C
+5VST_MST
SYS_RESET
10
0
R
80
12
0 .01uF
C877
0.01uF
C878
0.01uF
C879
TX
D
RX
D 0
.1
uF
C
86
3
ISA1530AC1
Q800
EB
C
ISA1530AC1
Q801
E BC
2.2uF
16VC8000READY
+3.3V_MULTI_MST
0
R
80
6
0
R
87
0
S_VIDEO_DET
SIDE_Y
SIDE_C
DDC_WP
OPC_EN
4.7K
R877
4.7K
R8004
4.7K
R817
470
R809
47
R8041
220R808
68
R810
0
R800
READY
0
R8001
390R840
47R814
47R816
47R818
47R838
47R833
47R836
470R803
47R804
47R815
47R897
47R802
47R831
47R857
47R830
47R875
47R876
100R846
100R847
1
0
0
R
8
0
3
9
H
D
M
I3
_
S
ID
E
1
0
0
R
8
0
4
0
H
D
M
I3
_
S
ID
E
4.7K R863
4.7K R864
100R8042
1KR8038
1KR8018
4.7KR865
4.7KR866
1K
R
86
7
1K
R
86
8
10
0
R
80
21
10
0
R
80
22
10
0
R
85
0
10
0
R
84
9
10
0
R
89
5
0
RE
AD
Y
R
80
17
0
RE
AD
Y
R
80
16
0
R
80
33
RE
AD
Y
0
R
80
34
0
R
80
35
10K
R8020
10K
R8003
0.047uFC800
0.047uFC801
0.047uFC827
0.047uFC825
0.047uFC847
0.047uFC845
0.047uFC843
0.047uFC836
0.1uFC868
1000pFC846
1K
R884
READY
1K
R889
1K
R811
READY
1K
R883
4.7K
R8028
4.7K
R8027
22R812
22R813
0.1uFC819
0.1uFC806
0.1uFC805
4.7K
Non_Small_FHD
R8010-*2
4.7K
Small_FHD
R8010-*1
4.7K
Small_HD
R896
4.7K
Apollo
R8010-*3
4.7K
Small_FHD
R896-*1
4.7K
Non_Small_HD
R8011-*1
4.7K
Non_Small_HD
R896-*2
4.7K
Apollo
R8011-*2
4.7K
Apollo
R898-*1
4.7K
Non_Small_FHD
R898
4.7K
100Hz
R8011-*3 4.7K
100Hz
R898-*2
4.7K R8011
Small_FHD
4.7K R8010
Small_HD
22R8005
22R8006
0
R
82
6
0
R
82
74 .7uF
10V
C871
READY
120-ohm
L800
1
2
0
-o
h
m
L
8
0
1
120-ohm
L802
2.
2u
F
C
82
3
2.
2u
F
C
82
4
2.
2u
F
C
82
1
2.
2u
F
C
87
3
2.
2u
F
C
82
2
2.
2u
F
C
87
4
2.
2u
F
C
80
2
2.
2u
F
C
87
5
MST99A88ML(MATRIX BASIC)
IC800
1 RXBCKN
2 RXBCKP
3 RXB0N
4 RXB0P
5 HOTPLUGB
6 RXB1N
7 RXB1P
8 AVDD_33_1
9 RXB2N
10 RXB2P
11 RXACKN
12 RXACKP
13 RXA0N
14 RXA0P
15 AVDD_33_2
16 RXA1N
17 RXA1P
18 GND_1
19 RXA2N
20 RXA2P
21 HOTPLUGA
22 REXT
23 VCLAMP
24 REFP
25 REFM
26 BIN1P
27 SOGIN1
28 GIN1P
29 RIN1P
30 BINM
31 BIN0P
32 GINM
33 GIN0P
34 SOGIN0
35 RINM
36 RIN0P
37 AVDD_33_3
38 GND_2
39 BIN2P
40 GIN2P
41 SOGIN2
42 RIN2P
43 CVBS6
44 CVBS5
45 CVBS4
46 CVBS3
47 CVBS2
48 CVBS1
49 VCOM1
50 CVBS0
51 VCOM0
52 AVDD_33_4
53 CVBSOUT
54 GND_3
55 SIF0P
56 SIF0M
57 VDDC_1
58 AUL5
59 AUR5
60 AUVRM
61 AUOUTL2
62 AUOUTR2
63 AUOUTL1
64 AUOUTR1
65
AU
L0
66
AU
R0
67
AU
L1
68
AU
R1
69
AU
L2
70
AU
R2
71
AU
L3
72
AU
R3
73
AU
CO
M
74
AU
L4
75
AU
R4
76
GN
D_
4
77
AU
VR
P
78
AU
VA
G
79
AV
DD
_A
U
80
GN
D_
5
81
VD
DC
_2
82
DD
CA
_C
K
83
DD
CA
_D
A
84
DD
CD
A_
CK
85
DD
CD
A_
DA
86
DD
CD
B_
CK
87
DD
CD
B_
DA
88
G
PI
O
20
89
VD
DP
_1
90
VD
DC
_3
91
UA
RT
2_
RX
92
UA
RT
2_
TX
93
DD
CD
C_
CK
94
RX
CC
KN
95
RX
CC
KP
96
DD
CD
C_
DA
97
RX
C0
N
98
RX
C0
P
99
GN
D_
6
10
0
RX
C1
N
10
1
RX
C1
P
10
2
AV
DD
_D
M
10
3
RX
C2
N
10
4
RX
C2
P
10
5
HO
TP
LU
GC
10
6
US
B1
_D
M
10
7
US
B1
_D
P
10
8
SC
K
10
9
SD
I
11
0
SD
O
11
1
SC
Z
11
2
PW
M0
11
3
PW
M1
11
4
PW
M2
11
5
PW
M3
11
6
LV
A4
P
11
7
LV
A4
M
11
8
LV
A3
P
11
9
LV
A3
M
12
0
LV
AC
KP
12
1
LV
AC
KM
12
2
LV
A2
P
12
3
LV
A2
M
12
4
LV
A1
P
12
5
LV
A1
M
12
6
LV
A0
P
12
7
LV
A0
M
12
8
VD
DP
_2 129LVB4P
130LVB4M
131LVB3P
132LVB3M
133LVBCKP
134LVBCKM
135LVB2P
136LVB2M
137LVB1P
138LVB1M
139LVB0P
140LVB0M
141AVDD_LPLL
142GND_7
143VDDC_4
144GPIO150/I2C_OUT_MUTE
145GPIO151/I2C_OUT_SD2
146GPIO152/I2C_OUT_SD3
147GND_8
148GPIO51
149GPIO52
150GPIO53
151GPIO54
152GPIO55
153GPIO56
154GPIO57
155GPIO58
156VDDP_3
157VDDC_5
158B_MDATA[4]
159B_MDATA[3]
160GND_9
161B_MDATA[1]
162B_MDATA[6]
163AVDD_DDR_1
164B_MDATA[11]
165B_MDATA[12]
166GND_10
167B_MDATA[9]
168B_MDATA[14]
169AVDD_DDR_2
170B_DDR2_DQM[1]
171B_DDR2_DQM[0]
172GND_11
173B_DDR2_DQS[0]
174B_DDR2_DQSB[0]
175AVDD_DDR_3
176VDDP_4
177GND_12
178B_DDR2_DQS[1]
179B_DDR2_DQSB[1]
180AVDD_DDR_4
181B_MDATA[15]
182B_MDATA[8]
183GND_13
184B_MDATA[10]
185B_MDATA[13]
186AVDD_DDR_5
187B_MDATA[7]
188B_MDATA[0]
189B_MDATA[2]
190B_MDATA[5]
191B_MCLK
192B_MCLKZ
19
3
GN
D_
14
19
4
AV
DD
_M
EM
PL
L
19
5
MV
RE
F
19
6
A_
OD
T
19
7
A_
RA
SZ
19
8
A_
CA
SZ
19
9
A_
M
AD
R[
0]
20
0
A_
M
AD
R[
2]
20
1
A_
M
AD
R[
4]
20
2
GN
D_
15
20
3
A_
M
AD
R[
6]
20
4
A_
M
AD
R[
8]
20
5
A_
M
AD
R[
11
]
20
6
A_
W
EZ
20
7
A_
BA
DR
[1
]
20
8
A_
BA
DR
[0
]
20
9
A_
M
AD
R[
1]
21
0
A_
M
AD
R[
10
]
21
1
AV
DD
_D
DR
_6
21
2
A_
M
AD
R[
5]
21
3
A_
M
AD
R[
9]
21
4
A_
M
AD
R[
12
]
21
5
A_
M
AD
R[
7]
21
6
A_
M
AD
R[
3]
21
7
A_
MC
LK
E
21
8
VD
DC
_6
21
9
I2
S_
IN
_W
S/
G
PI
O
67
22
0
I2
S_
IN
_B
C
K/
G
PI
O
68
22
1
I2
S_
IN
_S
D
22
2
I2S
_O
UT
_M
CK
22
3
I2
S_
O
UT
_W
S
22
4
VD
DP
_5
22
5
GN
D_
16
22
6
VD
DC
_7
22
7
I2
S_
O
UT
_B
CK
22
8
I2
S_
O
UT
_S
D
22
9
SP
DI
FO
23
0
UA
RT
2_
RX
/I2
CM
_S
DA
23
1
UA
RT
2_
TX
/I2
CM
_S
CK
23
2
UA
RT
1_
RX
/G
PI
O
86
23
3
UA
RT
1_
TX
/G
PI
O
87
23
4
GN
D_
17
23
5
GN
D_
18
23
6
US
B0
_D
M
23
7
US
B0
_D
P
23
8
SA
R0
23
9
SA
R1
24
0
SA
R2
24
1
SA
R3
24
2
AV
DD
_M
PL
L
24
3
XO
UT
24
4
XI
N
24
5
G
PI
O
13
4
24
6
G
PI
O
13
5
24
7
G
PI
O
13
8
24
8
G
PI
O
13
9
24
9
G
PI
O
14
0
25
0
IR
IN
25
1
HS
YN
C0
25
2
VS
YN
C0
25
3
HS
YN
C1
25
4
VS
YN
C1
25
5
CE
C
25
6
HW
RE
SE
T
LGE3767A [MST99A88ML(MATRIX ONLY SD DIVX_ NON RM) ]
IC800-*1
1RXBCKN
2RXBCKP
3RXB0N
4RXB0P
5HOTPLUGB
6RXB1N
7RXB1P
8AVDD_33_1
9RXB2N
10RXB2P
11RXACKN
12RXACKP
13RXA0N
14RXA0P
15AVDD_33_2
16RXA1N
17RXA1P
18GND_1
19RXA2N
20RXA2P
21HOTPLUGA
22REXT
23VCLAMP
24REFP
25REFM
26BIN1P
27SOGIN1
28GIN1P
29RIN1P
30BINM
31BIN0P
32GINM
33GIN0P
34SOGIN0
35RINM
36RIN0P
37AVDD_33_3
38GND_2
39BIN2P
40GIN2P
41SOGIN2
42RIN2P
43CVBS6
44CVBS5
45CVBS4
46CVBS3
47CVBS2
48CVBS1
49VCOM1
50CVBS0
51VCOM0
52AVDD_33_4
53CVBSOUT
54GND_3
55SIF0P
56SIF0M
57VDDC_1
58AUL5
59AUR5
60AUVRM
61AUOUTL2
62AUOUTR2
63AUOUTL1
64AUOUTR1
6
5
A
U
L
0
6
6
A
U
R
0
6
7
A
U
L
1
6
8
A
U
R
1
6
9
A
U
L
2
7
0
A
U
R
2
71
A
U
L
3
7
2
A
U
R
3
7
3
A
U
C
O
M
7
4
A
U
L
4
7
5
A
U
R
4
7
6
G
N
D
_
4
7
7
A
U
V
R
P
7
8
A
U
V
A
G
7
9
A
V
D
D
_A
U
8
0
G
N
D
_
5
8
1
V
D
D
C
_
2
8
2
D
D
C
A
_C
K
8
3
D
D
C
A
_D
A
8
4
D
D
C
D
A
_C
K
8
5
D
D
C
D
A
_D
A
8
6
D
D
C
D
B
_C
K
8
7
D
D
C
D
B
_D
A
8
8
G
P
IO
2
0
8
9
V
D
D
P
_
1
9
0
V
D
D
C
_
3
9
1
U
A
R
T
2
_
R
X
9
2
U
A
R
T
2
_
T
X
9
3
D
D
C
D
C
_C
K
9
4
R
X
C
C
K
N
9
5
R
X
C
C
K
P
9
6
D
D
C
D
C
_D
A
9
7
R
X
C
0N
9
8
R
X
C
0
P
9
9
G
N
D
_
6
1
0
0
R
X
C
1N
1
0
1
R
X
C
1
P
1
0
2
A
V
D
D
_D
M
1
0
3
R
X
C
2N
1
0
4
R
X
C
2
P
1
0
5
H
O
T
P
LU
G
C
1
0
6
U
S
B
1_
D
M
1
0
7
U
S
B
1
_
D
P
1
0
8
S
C
K
1
0
9
S
D
I
1
1
0
S
D
O
1
1
1
S
C
Z
1
1
2
P
W
M
0
1
1
3
P
W
M
1
1
1
4
P
W
M
2
1
1
5
P
W
M
3
1
1
6
L
V
A
4
P
1
1
7
LV
A
4M
1
1
8
L
V
A
3
P
1
1
9
LV
A
3M
1
2
0
LV
A
C
K
P
1
2
1
LV
A
C
K
M
1
2
2
L
V
A
2
P
1
2
3
LV
A
2M
1
2
4
L
V
A
1
P
1
2
5
LV
A
1M
1
2
6
L
V
A
0
P
1
2
7
LV
A
0M
1
2
8
V
D
D
P
_
2
129 LVB4P
130 LVB4M
131 LVB3P
132 LVB3M
133 LVBCKP
134 LVBCKM
135 LVB2P
136 LVB2M
137 LVB1P
138 LVB1M
139 LVB0P
140 LVB0M
141 AVDD_LPLL
142 GND_7
143 VDDC_4
144 GPIO150/I2C_OUT_MUTE
145 GPIO151/I2C_OUT_SD2
146 GPIO152/I2C_OUT_SD3
147 GND_8
148 GPIO51
149 GPIO52
150 GPIO53
151 GPIO54
152 GPIO55
153 GPIO56
154 GPIO57
155 GPIO58
156 VDDP_3
157 VDDC_5
158 B_MDATA[4]
159 B_MDATA[3]
160 GND_9
161 B_MDATA[1]
162 B_MDATA[6]
163 AVDD_DDR_1
164 B_MDATA[11]
165 B_MDATA[12]
166 GND_10
167 B_MDATA[9]
168 B_MDATA[14]
169 AVDD_DDR_2
170 B_DDR2_DQM[1]
171 B_DDR2_DQM[0]
172 GND_11
173 B_DDR2_DQS[0]
174 B_DDR2_DQSB[0]
175 AVDD_DDR_3
176 VDDP_4
177 GND_12
178 B_DDR2_DQS[1]
179 B_DDR2_DQSB[1]
180 AVDD_DDR_4
181 B_MDATA[15]
182 B_MDATA[8]
183 GND_13
184 B_MDATA[10]
185 B_MDATA[13]
186 AVDD_DDR_5
187 B_MDATA[7]
188 B_MDATA[0]
189 B_MDATA[2]
190 B_MDATA[5]
191 B_MCLK
192 B_MCLKZ1
9
3
G
N
D
_
1
4
1
9
4
A
V
D
D
_M
E
M
P
LL
1
9
5
M
V
R
E
F
1
9
6
A
_O
D
T
1
9
7
A
_
R
A
S
Z
1
9
8
A
_
C
A
S
Z
1
9
9
A
_
M
A
D
R
[0
]
2
0
0
A
_
M
A
D
R
[2
]
2
0
1
A
_
M
A
D
R
[4
]
2
0
2
G
N
D
_
1
5
2
0
3
A
_
M
A
D
R
[6
]
2
0
4
A
_
M
A
D
R
[8
]
2
0
5
A
_
M
A
D
R
[1
1
]
2
0
6
A
_W
E
Z
2
0
7
A
_
B
A
D
R
[1
]
2
0
8
A
_
B
A
D
R
[0
]
2
0
9
A
_
M
A
D
R
[1
]
2
1
0
A
_
M
A
D
R
[1
0
]
2
1
1
A
V
D
D
_D
D
R
_6
2
1
2
A
_
M
A
D
R
[5
]
2
1
3
A
_
M
A
D
R
[9
]
2
1
4
A
_
M
A
D
R
[1
2
]
2
1
5
A
_
M
A
D
R
[7
]
2
1
6
A
_
M
A
D
R
[3
]
2
1
7
A
_M
C
LK
E
2
1
8
V
D
D
C
_
6
2
1
9
I2
S
_
IN
_
W
S
/G
P
IO
6
7
2
2
0
I2
S
_
IN
_
B
C
K
/G
P
IO
6
8
2
2
1
I2
S
_
IN
_
S
D
2
2
2
I2
S
_
O
U
T
_
M
C
K
2
2
3
I2
S
_
O
U
T
_
W
S
2
2
4
V
D
D
P
_
5
2
2
5
G
N
D
_
1
6
2
2
6
V
D
D
C
_
7
2
2
7
I2
S
_
O
U
T
_
B
C
K
2
2
8
I2
S
_
O
U
T
_
S
D
2
2
9
S
P
D
IF
O
2
3
0
U
A
R
T
2
_
R
X
/I2
C
M
_
S
D
A
2
3
1
U
A
R
T
2
_
T
X
/I
2
C
M
_
S
C
K
2
3
2
U
A
R
T
1
_
R
X
/G
P
IO
8
6
2
3
3
U
A
R
T
1
_
T
X
/G
P
IO
8
7
2
3
4
G
N
D
_
1
7
2
3
5
G
N
D
_
1
8
2
3
6
U
S
B
0_
D
M
2
3
7
U
S
B
0
_
D
P
2
3
8
S
A
R
0
2
3
9
S
A
R
1
2
4
0
S
A
R
2
2
4
1
S
A
R
3
2
4
2
A
V
D
D
_M
P
LL
2
4
3
X
O
U
T
2
4
4
X
IN
2
4
5
G
P
IO
1
3
4
2
4
6
G
P
IO
1
3
5
2
4
7
G
P
IO
1
3
8
2
4
8
G
P
IO
1
3
9
2
4
9
G
P
IO
1
4
0
2
5
0
IR
IN
2
5
1
H
S
Y
N
C
0
2
5
2
V
S
Y
N
C
0
2
5
3
H
S
Y
N
C
1
2
5
4
V
S
Y
N
C
1
2
5
5
C
E
C
2
5
6
H
W
R
E
S
E
T
3.3KR819
DS
UB
_S
DA
LE
D_
R
RT1C3904-T112
Q805
READY
E
BC DDC_WP
10K
R828
READY
4.7K
R878
4.7KR893
1KR861
0
R8037
NON 19_22"
0
R
89
4
0
R
89
9
2K
R886
150R885
1KR860
10K
R8000
33KR8007
NON 19_22"
10K
R855
1K
R853
100R888
33K
R887
20K
R8036
19_22_26"
20
pF
C
81
7 2
0p
F
C
81
6
DD
R2
_A
[2
]
DDR2_D[1]
DD
R2
_A
[6
]
G
N
D
DDR2_D[5]
DD
R2
_A
[1
0]
DDR2_D[0]
DDR2_D[10]
DD
R2
_A
[1
2]
DDR2_D[14]
DD
R2
_A
[0
]
DDR2_D[6]
DD
R2
_A
[5
]
DDR2_D[3]
DD
R2
_A
[4
]
DDR2_D[4]
DDR2_D[12]
DD
R2
_A
[9
]
DDR2_D[11]
DD
R2
_A
[8
]
DDR2_D[8]
DDR2_D[7]
DDR2_D[15]
DDR2_D[9]
DD
R2
_A
[3
]
DDR2_D[13]
DD
R2
_A
[1
1]
DDR2_D[2]
DD
R2
_A
[1
]
DD
R2
_A
[7
]
TXCE4-
TXCE4+
TXCE3-
TXCE3+
TXCLKE-
TXCLKE+
TXCE2-
TXCE2+
TXCE1-
TXCE1+
TXCE0-
TXCE0+
TXCO4-
TXCO4+
TXCO3-
TXCO3+
TXCLKO-
TXCLKO+
TXCO2-
TXCO2+
TXCO1-
TXCO1+
TXCO0-
TXCO0+
I2S_OUT
HDMI_3
EEPROM
HD
M
I_1
[MODE SELECTION]
HD
M
I_2
C804/C805/C806:Close to IC 
 a s c l o s e a s p o s s i b l e
GAIN X 4
RESET
C
lo
se
 t
o 
IC
w
it
h 
w
id
th
 t
ra
ce
C l o s e t o I C a s c l o s e a s p o s s i b l e
HDCP EEPROM
US
B 
PA
RT
SERIAL FLASH 64M
S-VIDEO
4.7K X
4.7K
4.7K
X4.7K
R8010
X
R898
Non Small FHD
4.7K
X 4.7K
Small HD
*H/W OPTION
4.7K
4.7K 4.7K
100HZ
4.7K
4.7K4.7K
Apollo
Non Small HD
R8011
X
X
X
4.7K
X
R896
X
Small FHD (27)
4.7K
X
** Sma l l HD : 19 /22 /26 Inch
** Non Small FHD : Normal(non 100Hz) FHD Model
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
SC
H
EM
ATIC
 D
IA
G
R
A
M
C
opyright LG
 E
lectronics. Inc. A
ll right reserved. 
O
nly for training and service purposes
LG
E
 Internal U
se O
nly
M
S
TA
R
+1.8V_DDR
DDR2_A[0-12]
DDR2_BA0
DDR2_BA1
DDR2_MCLK
DDR2_MCLKZ
DDR2_CKE
DDR2_ODT
DDR2_RASZ
DDR2_CASZ
DDR2_WEZ
DDR2_DQS0P
DDR2_DQS1P
DDR2_DQM0
DDR2_DQM1
DDR2_DQS0M
DDR2_DQS1M
+1.8V_DDR
+1.8V_DDR
DDR2_D[0-15]
1000pF
C905
V_REF
56
R900
56
R901
56
R902
56
R903
56
R904
56
R905
0.01uF
C904
0.01uF
50V
C900
0.01uF
C901
0.01uF
C902
0.01uF
C903
0.01uF
C906
0.01uF
C907
0.01uF
C908
0.01uF
C909
0.01uF
C910
0.01uF
C911
0.01uF
C912
0.01uF
C913
0.01uF
C914
0.01uF
C915
0.01uF
C916
0.01uF
C917
+1.8V_DDR
150
R906
READY
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
V_REF
0.1uF
50V
C918
HYB18TC512160B2F-2.5 
IC900
J2VREF
J8CK
H2 VSSQ2
B7UDQS
N8A4
P8A8
L1NC4
L2BA0
R8NC3
K7RAS
F8 VSSQ3
F3LDM
P3A9
M3A1
N3A5
K8CK
R3NC5
L3BA1
J7VSSDL
L7CAS
F2 VSSQ4
B3UDM
M2A10/AP
K2CKE
R7NC6
M7A2
N7A6
M8A0
J1VDDL
K3WE
E8LDQS
P7A11
K9ODT
A2NC1
N2A3
P2A7
H8 VSSQ1
F7LDQS
A8UDQS
R2A12
L8CS
E2NC2
E7 VSSQ5
D8 VSSQ6
D2 VSSQ7
A7 VSSQ8
B8 VSSQ9
B2 VSSQ10
P9 VSS1
N1 VSS2
J3 VSS3
E3 VSS4
A3 VSS5
G9 VDDQ1
G7 VDDQ2
G3 VDDQ3
G1 VDDQ4
E9 VDDQ5
C9 VDDQ6
C7 VDDQ7
C3 VDDQ8
C1 VDDQ9
A9 VDDQ10
R1 VDD1
M9 VDD2
J9 VDD3
E1 VDD4
A1 VDD5
B9 DQ15
B1 DQ14
D9 DQ13
D1 DQ12
D3 DQ11
D7 DQ10
C2 DQ9
C8 DQ8
F9 DQ7
F1 DQ6
H9 DQ5
H1 DQ4
H3 DQ3
H7 DQ2
G2 DQ1
G8 DQ0
10uF
10V
C919
1
K
R
9
0
7
1
K
R
9
0
8
DDR2_A[0]
DDR2_A[12]
DDR2_A[11]
DDR2_A[1]
DDR2_A[2]
DDR2_A[3]
DDR2_A[4]
DDR2_A[5]
DDR2_A[6]
DDR2_A[7]
DDR2_A[8]
DDR2_A[9]
DDR2_A[10]
DDR2_D[0-15]
DDR2_D[0]
DDR2_D[1]
DDR2_D[2]
DDR2_D[3]
DDR2_D[4]
DDR2_D[5]
DDR2_D[6]
DDR2_D[7]
DDR2_D[8]
DDR2_D[9]
DDR2_D[10]
DDR2_D[11]
DDR2_D[12]
DDR2_D[13]
DDR2_D[14]
DDR2_D[15]
DDR2 MEMORY
Close to DDR2 IC
Close to DDR2 IC
C
opyright LG
 E
lectronics. Inc. A
ll right reserved. 
O
nly for training and service purposes
LG
E
 Internal U
se O
nly
D
D
R
2
47uF 25V
C1002
10KR1003
NON 19_22"
0.01uF
C1007
DISP_EN/VAVS_ON
0.01uF
C1046
RL_ON
SAM2333
D1002
0.01uF
C1008
2SC3875S
Q1000
NON 19_22"
1 2
3
0.01uF
C1011
0.01uF
C1021
2SC3875S
Q10021
2
3
100R1044-*1
PWM_DIM
10KR1047
E-DIMI-DIM
4.7KR1054
NON SHARP 32&52",AUO PANEL_STATUS
33K
R1065
NON 19_22"
1uF25V
C1056
33K
R1049
10KR1048
RT1C3904-T112
Q1001
E
B
C
0.01uF
C1010
0.1uF
C1005
100uF16V
C1009
POWER_SW
10K
R1002
SI4925BDY
EBK32753101
Q1003
3S2
2G1
4G2
1S1
5 D2_1
6 D2_2
7 D1_1
8 D1_2
RT1C3904-T112
Q1004
E
B
C
10K
R1068
1.6K
R1069
22K
R1070 1uF
C1048
0.01uF
C1053
0
CMO 32,42,47,57
R1045
0
CMO 32,42,47
R1039
0
CMO 57"
R1040
0
NON CMO 32,42,47,57
R1043
0
CMO 57"
R1041
0R1064
0
NON (CMO 32,42,47,57, SHARP 32")
R1023
0
SHARP 52",AUO
R1053
0
NON CMO 57"
R1001
0
CMO 32,42,47,57
R1014
0
R1042
1.2K
R1005
P_12V_SMALL_15V
P_5V
P_5V
P_12V_SMALL_15V
+16V_NTP
+12V_AUDIO
+5VST_MST
P_12V_SMALL_15V
+5VST_MST +3.3V_MST
+5V_USB
+5V_TUNER
+5V_+12V_LCD
+5V_MULTI
P_5V
+5V_MULTI
P_5V P_12V_SMALL_15V
P_5V
+5VST_MST +5V_MULTI
PANEL_ON
0.1uF
50V
C1001
10uF16V
C1052
10uF 16V
C1019
10uF
16V
C1003
1
/4
W
0 5%R
1
0
7
4
1
9
_
2
2
"
SMAW200-11
P1002
19_22"
1
15V
2
15V
3
GND
4
GND
5
5V
6
5V
7
NC
8
NC
9
Inverter_ON
10
PWM_Dim
11
A.Dim
P_5V
P_24V_SMALL_15V
P_12V_SMALL_15V
P_24V_SMALL_15V
P_24V_SMALL_15V
OPC_OUT
0
READY
R1077
10K19_22"
R1065-*1
MP2212DN
IC1006
3IN
2GND
4BS
1FB
5 VCC
6 SW_1
7 SW_2
8 EN/SYNC
+5V_MULTI
10
R1056READY
0.1uF
50V
C1024
READY
10K
R1059
NON 19_22"
100uF
16V
C1026
5.6K
R1058
30K
R1057
S2A 50V
19_22"
D1001
10uF
25V
C1030
10uF
25V
C1031
10uF
16V
C1000
10uF
16V
C1020
+1.2V_VDDC_MST
0R1073
0.1uF
C1054
+3.3V_MULTI_MST
100uF16V
C1028
+1.8V_DDR
+1.8V
+5V_MULTI
AP2121N-3.3TRE1 
IC1007
1
GND
2 VOUT3VIN
0.1uF
16V
C1014
BD9130EFJ-E2
IC1001
3
ITH
2
VCC
4
GND
1
ADJ
5
PGND
6
SW
7
PVCC
8
EN
10K
R1006
1
/1
0
W
2
K
1%R
1
0
0
9
1
/1
0
W
3.3K
1%
R1010
10uF
10V
C1016
10uF
6.3V
C1022
0.1uF
50V
C1015
0.1uF
50V
C1023
12K
R1008
560pF
50V
C1012
2200pF
50V
C1055
READY
3 . 3
R1078
READY
10uF
16V
C1004
10uF
16V
C1013
10K
R1079
AZ1085S-3.3TR/E1
IC1003
1
ADJ/GND
2 OUTPUT3INPUT
10uF
16V
C1017
10uF
16V
C1018
AP1117EG-13 
IC1002
1
ADJ/GND
2 OUT3IN
1KR1044
DC_DIM
1K
R1076
OPC_DISABLE
1K
R1075
OPC_ENABLE
0
R1013
2.2K
R1050
2.2K
R1051
2.2K
R1052
68uF
35V
C1006
0
R1012
NON 19_22"
3.6uHL1009
CIC21J501NE
EAM58113401
L1000
CIC21J501NE
L1008
FW20020-24S
P1000
NON_19_22_26"
19NC
14 12V
95.2V
4 GND
18 24V
1312V
8 5.2V
3GND
1724V
12 GND
75.2V
2 Power ON
16 GND
11GND
6 GND
1NC
20 Inver te r ON
15GND
10 5.2V
5GND
21A.Dim 22 Er ro r Ou t
23NC 24 PWM Dim
120
5%
R1004
56
1%
R1007
10KR1017
19_22"
2SC3875S
Q1005
19_22"
1 2
3
RL_ON
+5V_MULTI
10R1015
19_22"
4.7K
R1016
19_22"
120-ohm
L1001
120-ohm
19/22"(HD)/22"(FHD)/32"(Sharp)
L1005
120-ohm
26/27/32(LPL) /37 /42 /47 /52"
L1006
0LCML00003B
MLB-201209-0120P-N2
L1007
MLB-201209-0120P-N2
L1010
MLB-201209-0120P-N2
120-ohm
L1012
MLB-201209-0120P-N2
120-ohm
L1013
1uF 25V
C1035
0.1uF
16V
C1025
0.47uF
25V C1043
NON SHARP 52",AUO
2.2uF 16V
C1045
DC_DIM
2.2uF 16V
C1044
3K
R1046
FM20020-24
P1001
26"
19NC
14 12V
95.2V
4 GND
18 24V
1312V
8 5.2V
3GND
1724V
12 GND
75.2V
2 Power ON
16 GND
11GND
6 GND
1NC
20 Inver te r ON
15GND
10 5.2V
5GND
21A.Dim 22 Er ro r Ou t
23NC 24 PWM Dim
25
.
2.2uH
L1002
10K
R1020
2K
R1018
NON 19_22"
1K
OPC_DISABLE
R1021 1K
OPC_ENABLE
R1022
68uF
35V
C1027
READY
10
R1024
0.1uF
50V
C1029
+5V_MULTI
0
R1011
560pF
50V
C1032
2.2K
R1000
NON 19_22"
1uF 25V
READY
C1034
1uF 25V
READY
C1036
1uF 25V
READY
C1037
1uF 25V
READY
C1038
0.1uF
50V
C1033
LED Block
**5V_MULTI->3.3V->1.2V
**Switch 12V:P12V 
**Switch 5V:5V_MULTI -> 1.8V
*SHARP32":DC DIMMING
**DC-DC CONVERTER
 12V->5V_TUNER/USB
OUT:5V
*ST 5V->3.3V
**OPC_ENABLE : USE LGD Module
MAX 300mA
MAX 3A
OUT:1.27V
NTP,AUDIO DSP
DDR2, Vref
V0 = 0 .8* (1+(R2/R1) )
MAX 2A
MAX 3A
R1
R2
MAX 1A
OUT:3.3V
R1
R2
V0 = 0 .8* (1+(R1/R2) )
V0 = 1 .25*(1+(R2/R1))
R1
R2
OUT:1.85V
Smal l (19_22")
Close to Q1003
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C
opyright LG
 E
lectronics. Inc. A
ll right reserved. 
O
nly for training and service purposes
LG
E
 Internal U
se O
nly
P
O
W
E
R
0.1uF
C644
0.1uF
C637
M
_S
DA
1000pF
C606
22000pF
C616
22000pFC623+1.8V_DVDD
1000pF
50V
C651
0.47uF
C632
MULTI_PW_SW
0.1uF
C605
+1.8V_DVDD
0.1uF
C615
0.1uF
C629
AM
P_
M
UT
E_
HO
TE
L
+3.3V_MULTI_MST
0.1uF
C643
DA-8580
EAP38319001
L607
2S
1S 1F
2F
0.1uF
C617
0.1uF
C602
0.01uF
C647
SPK_R+
M
_S
CL
0 .1uF
C610
DA-8580
EAP38319001
L603
2S
1S 1F
2F
22000pFC611
SPK_L+
+1.8V_AVDD
SPK_L-
0.1uF
C669
+16V_NTP
+16V_NTP
SPK_R-
100pF
C601
22000pF
C625
+1.8V_AVDD
0.01uF
C672
0.01uF
C648
1000pF
C603
SW_RESET
0.47uF
C673
0.01uF
C671
0.1uF
C626
0.01uF
C613
330uF35V
C612
SPK_L-
SPK_R+
+1.8V_DVDD
SPK_R-
SMAW250-04
P600
1
2
3
4SPK_L+
+1.8V_AVDD
+1.8V
I2S_MCLK
I2
S_
SD
O
I2
S_
W
S
I2
S_
SC
K
390pF
C619
390pF
C621
390pF
C630
390pF
C634
1uF
C608
1uF
C618
1uF
C624
1uF
C614
0.1uF
50V
C607
10uF
35V
C642READY
+12V_AUDIO
MNT_R_AMP
+12V_AUDIO
RT1C3904-T112
Q600
E
B
C
RT1C3904-T112
Q601
E
B
C
MNT_L_AMP
0.01uF
C635
MNT_ROUT
+12V_AUDIO
LM324D
IC601
3 INPUT1+
2 INPUT1-
4 VCC
1 OUT1
6 INPUT2-
5 INPUT2+
7 OUT2 8OUT3
9INPUT3-
10INPUT3+
11GND
12INPUT4+
13INPUT4-
14OUT4
6800pF
C628
6800pF
C627
MNT_LOUT
AUDIO_R
SPK_R-_HOTEL
SPK_R+_HOTEL
12505WR-09A00
HOTEL_OPT
P601
1
2
3
4
5
6
7
8
9
10
0.1uF
HOTEL_OPT
C636
+16V_NTP
RT1C3904-T112
HOTEL_OPT
Q602
E
B
C
AMP_MUTE_HOTEL
+3.3V_MULTI_MST
SW_RESET
10uF
16V
C600
10uF
16V
C604
10uF16V
C609
3 . 3
R604
12
R608
12
R611
12
R610
12
R638
4.7K
R663
4.7K
R623
3 . 3
R626
3 . 3
R625
100R601
3.3K
R600
1
0
0
R
6
7
6
1
0
0
R
6
7
7
1
0
0
R
6
7
8
100
R602
100
R603 0
R
65
6
HO
TE
L_
OP
T
0R673
12
R658
12
R653
12
R621
12
R654
4.7K
R628
4.7K
R667
3 . 3
R671
3 . 3
R635
1K
R607
10K
NON_HOTEL_OPT
R613
12K
HOTEL_OPT
R613-*
5.6KR614
5.6KR615
10K
NON_HOTEL_OPT
R616
12K
HOTEL_OPT
R616-*
1K
R609
4.7K
R606
200
HOTEL_OPT
R612
10K
HOTEL_OPT
R617
0
HOTEL_OPT
R620
0
HOTEL_OPT
R619
4.7K
R605 33pFC631
33pFC633
0.1uF
C620
0.1uF
C622
6.8K
R618
6.8K
R622
NTP-3100L
IC600
1BST1A
2VDR1A
3RESET
4AD
5DVSS_1
6VSS_IO
7CLK_I
8VDD_IO
9DGND_PLL
10AGND_PLL
11LFM
12AVDD_PLL
13DVDD_PLL
14TEST0
15
DV
SS
_2
16
DV
DD
17
SD
AT
A
18
W
CK
19
BC
K
20
SD
A
21
SC
L
22
M
ON
IT
OR
_0
23
M
ON
IT
OR
_1
24
M
ON
IT
OR
_2
25
FA
UL
T
26
VD
R2
B
27
BS
T2
B
28
PG
ND
2B
_1
29 PGND2B_2
30 OUT2B_1
31 OUT2B_2
32 PVDD2B_1
33 PVDD2B_2
34 PVDD2A_1
35 PVDD2A_2
36 OUT2A_1
37 OUT2A_2
38 PGND2A_1
39 PGND2A_2
40 BST2A
41 VDR2A
42 NC
43
VD
R1
B
44
BS
T1
B
45
PG
ND
1B
_1
46
PG
ND
1B
_2
47
O
UT
1B
_1
48
O
UT
1B
_2
49
PV
DD
1B
_1
50
PV
DD
1B
_2
51
PV
DD
1A
_1
52
PV
DD
1A
_2
53
O
UT
1A
_1
54
O
UT
1A
_2
55
PG
ND
1A
_1
56
PG
ND
1A
_2
MLB-201209-0120P-N2
0LCML00003B
120-ohm
L605
MLB-201209-0120P-N2
0LCML00003B
120-ohm
L606
33pF
50V
C638
READY
33pF
50V
C639
READY
+3.3V_MST
10K
R630
RT1C3904-T112
Q603
E
B
C
10KR629
MULTI_PW_SW
0
R627
READY
0
R624
READY
22K
R631READY
SPK_L-
Main AMP
AMP :GAIN X 4
Chinese Hote l Opt ion
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C
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O
nly for training and service purposes
LG
E
 Internal Use O
nly
A
U
D
I
MAIN_SIF
0.01uF
C501
M_SDA
27pF
C500
+5V_TUNER
TV_MAIN
M_SCL
+5V_TUNER
C504
READY
27pF
C502
10uH
L502
READY
82pF
C507
READY
10uF
16V
C508
120-ohm
L500
READY
ISA1530AC1
Q502
E
B
C
TAFT-H203F
TU500-*1
NTSC_TUNER
14
NC_5
13
V-OUT
5
RF_AGC
12
NC_4
11
MOPLL_AS
2
GND_1
19
NC_8
18
NC_7
10
SCL
4
NC_2
1
NC_1
17
NC_6
9
SDA
8
GND_2
3
+B[5V]
16
SIF-OUT
7
NC_3
6
TP[3.3V_OPT]
15
A-OUT
21
SHIELD
20
NC_9
TAFT-Z203D
TU500
PAL_TUNER
14 NC_5
13 V-OUT
5 RF_AGC
12 NC_4
11 MOPLL_AS
2 GND_1
19 NC_8
18 NC_7
10 SCL
4 NC_2
1 NC_1
17 NC_6
9 SDA
8 GND_2
3 +B[5V]
16 SIF-OUT
7 NC_3
6 TP[3.3V_OPT]
15 A-OUT
21
SHIELD
20 NC_9
4.7K
R502
220
R506
220
R507
100uF16V
C505
100uF16V
C509
100uF16V
C506
120-ohm
L501
47R504
47R505
0.1uF
50V
C503
0
L501-*1
0 Ohm
Near the p in
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C
opyright LG
 E
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ll right reserved. 
O
nly for training and service purposes
LG
E
 Internal U
se O
nly
T
U
N
E
R
TMDS3_RX2-
+5V_HDMI_2
TMDS3_RXC-
HPD_MST_2
TMDS3_RX0+
TMDS2_RX2-
CEC
TMDS2_RXC-
TMDS2_RXC+
TMDS1_RXC-
TMDS2_RX0+
TMDS3_RX0-
TMDS3_RX1+
TMDS3_RXC+
+5V_HDMI_2
HPD_MST_1
CEC
TMDS1_RX2+
TMDS2_RX1+
+5V_MULTI
+5V_HDMI_1
TMDS3_RX2+
TMDS2_RX0-
TMDS1_RX1-
TMDS2_RX1-
TMDS1_RX2-
+5V_HDMI_3
TMDS3_RX1-
+5V_MULTI
+5V_HDMI_3
+5V_MULTI
+5V_HDMI_1
TMDS1_RX0-
TMDS1_RX1+
CEC
TMDS1_RX0+
TMDS2_RX2+
TMDS1_RXC+
HPD_MST_3
DDC_SDA2
DDC_SCL2
DDC_SDA1
DDC_SCL1
DDC_SDA3
DDC_SCL3
JP304
JP305
JP301
JP300
JP302
JP303
2SC3875S
RT1C3904-T112
Q301
E
B
C
2SC3875S
RT1C3904-T112
Q300
E
B
C
2SC3875S
RT1C3904-T112
Q302
E
B
C
KJA-ET-0-0032 
JK303
14 NC
13 CEC
5 DATA1_SHIELD
20
JACK_GND
12 CLK-
11 CLK_SHIELD
2 DATA2_SHIELD
19 HPD
18+5V_POWER
10 CLK+
4 DATA1+
1 DATA2+
17DDC/CEC_GND
9 DATA0-
8 DATA0_SHIELD
3 DATA2-
16 SDA
7 DATA0+
6 DATA1-
15 SCL
KDS184S
D300A
1
C
A
2
KDS184S
D301A
1
C
A
2
KDS184S
D302A
1
C
A
2
CAT24C02WI-GT3
IC301
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
CAT24C02WI-GT3
IC302
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
CAT24C02WI-GT3
IC300
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
DDC_WP DDC_WP
DDC_WP BSS83CEC_READY
Q303
S
B
D
G CEC
+3.3V_MST
CEC_C
CDS3C30GTH
30V CEC_READY
D304
MMBD301LT1G
30V
CEC_READY
D303
10K
R301
1K
R303
0.01uF
C300
10K
R300
1K
R302
100R329
1K
R314
10K
R312
68K
CEC_READY
R315
0
R313
100R317
100R318100R305
100R304
0.01uF
C301
100R331
100R306
100R307
0.01uF
C302
100R327
10K
R308
10K
R310
10K
R309
10K
R311
10K
R319
10K
R320
QJ41193-CFEE1-7F
JK301
1 DATA2+
2 DATA2_SHIELD
3 DATA2-
4 DATA1+
5 DATA1_SHIELD
6 DATA1-
7 DATA0+
8 DATA0_SHIELD
9 DATA0-
10 CLK+
11
12
13
14
15
16
17
18
19
20JACK_GND
21 .
22
QJ41193-CFEE1-7F
JK302
1 DATA2+
2 DATA2_SHIELD
3 DATA2-
4 DATA1+
5 DATA1_SHIELD
6 DATA1-
7 DATA0+
8 DATA0_SHIELD
9 DATA0-
10 CLK+
11
12
13
14
15
16
17
18
19
20JACK_GND
21 .
22
56K
CEC_READY
R316
OPTION
SW_HPD : USE SW HPD (Default)
MST_HPD : USE MST HPD
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C
opyright LG
 E
lectronics. Inc. A
ll right reserved. 
O
nly for training and service purposes
LG
E
 Internal U
se O
nly
H
D
M
I
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
CVBS_LIN
MUTE_LINE
AUDIO_R
SD05
ZD100
100uF16V C102
SD05
ZD103
SD05
ZD105
MNT_ROUT
CVBS_VIN
SPK_R+_HOTEL
RT1C3904-T112
Q100
EB
C
SPK_R-_HOTEL
CVBS_RIN
SD05
ZD104
10uF16V C101
MUTE_LINE
SD05
ZD101
SD05
ZD102
MNT_LOUT
RT1C3904-T112
Q101 E
B
C
MNT_VOUT
10uF16V C100
30V
NON_HOTEL_OPT
D102
30V
NON_HOTEL_OPT
D103
30V
D101
30VADUC30S03010L_AMODIODE 
D100
30V
D104
30V
D105
COMP2_Y
COMP2_PB
COMP2_PR
COMP2_L
COMP2_R
S_VIDEO_DET
SIDE_Y
SIDE_C
+3.3V_MULTI_MST
OPT
READY
C104
30V
D106
30V
D107
SD05
ZD106
SD05
ZD107
PSJ014-01
JK101
S-VIDEO
GND
6
1
C-LUG1
2
C-LUG2
3
0-SPRING
4
C-LUG3
5 C-LUG4
SHIELD7
75R102
0
HOTEL_OPT
R103
0
HOTEL_OPT
R105
0
NON_HOTEL_OPT
R106
0
HOTEL_OPT
R101
75
R109
75
R108
75
R107
220K
R104
12K
R118
12K
R117
12K
R119
12K
R120
10KR113
10KR115
10KR116
220K
R100
220K
R111
220K
R112
75
R110
75
R122
S-VIDEO
75
R121
S-VIDEO
10K
R123
100pF
READY
C103
10KR114
PPJ226-01
JK100
9A [GN]1P_CAN
4A [GN]O-SPRING_A
3A [GN]CONTACT_A
9B [BL]1P_CAN
8B [BL]C-LUG_A
9C [RD]1P_CAN_1
8C [RD]C-LUG_A
9D [WH]1P_CAN
8D [WH]C-LUG_A_1
9E[RD]1P_CAN_2
4E[RD]O-SPRING_A_1
3E [RD]CONTACT_A_1
9F [YL]2P_CAN
4F [YL]O-SPRING_A
3F [YL]CONTACT_A
9G [WH]2P_CAN
8G [WH]C-LUG_A_2
9H [RD]2P_CAN
4H [RD]O-SPRING_A_2
3H [RD]CONTACT_A_2
5J[YL]O-SPRING_B
6J[YL]CONTACT_B
7K[WH]C-LUG_B
5L[RD]O-SPRING_B
6L[RD]CONTACT_B
POP NOISE
M
NT
_O
UT
CO
M
PO
NENT1
POP NOISE
AV1
COMPONENT1, AV1, MNT_OUT[JACK PACK TYPE D] : JK100
S-VIDEO(China Model)
C
opyright LG
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lectronics. Inc. A
ll right reserved. 
O
nly for training and service purposes
LG
E
 Internal U
se O
nly
IN
P
U
T
1
USB_DN
USB_DP
SIDE_LIN
SIDE_RIN
5.6B
ZD203
SIDE_V
PPJ218-01
JK201
5C[RD]CONTACT
2C[RD]U_CAN
4C[RD]O_SPRING
2B[WH]U_CAN
3B[WH]C_LUG
2A[YL]U_CAN
5A[YL]CONTACT
4A[YL]O_SPRING
5.6B
ZD202
U
S
B
 D
O
W
N
 S
T
R
E
A
M
KJ
A-
U
B-
4-
00
04
SIDE_USB
JK204
1
2
3
4
5
IR_OUT
+3.3V_MST
TXD
4.7K
R204
ST3232CDR
IC200
3C1-
2V+
4C2+
1C1+
6V-
5C2-
7T2OUT
8R2IN 9 R2OUT
10 T2IN
11 T1IN
12 R1OUT
13 R1IN
14 T1OUT
15 GND
16 VCC
4.7K
R205
RXD
KCN-DS-1-0088
JK200
1
2
3
4
5
6
7
8
9
10
+3.3V_MST
+5VST_MST
6630TGA004K
KCN-DS-1-0089
JK202
1
RED
2
GREEN
3
BLUE
4
GND_1
5
DDC_GND
6 RED_GND
7 GREEN_GND
8 BLUE_GND
9 NC
10 SYNC_GND
11
GND_2
12 DDC_DATA
13 H_SYNC
14 V_SYNC
15 DDC_CLOCK
16 SHILED
SD05
ZD200
DSUB_SDA
PC_VS
SD05
ZD201
E
N
K
M
C
2
8
3
7
-T
1
1
2
D
2
1
1A
A
C
C
PC_B
E
N
K
M
C
2
8
3
7
-T
1
1
2
D
2
1
0A
A
C
C
PEJ024-01
JK203
6B T_TERMINAL2
8 SHIELD_PLATE
7B B_TERMINAL2
5 T_SPRING
4 R_SPRING
7A B_TERMINAL1
6A T_TERMINAL1
3 E_SPRING
DSUB_SDA
PC_AUD_R
PC_G
DSUB_SCL
CAT24C02WI-GT3
IC201
3
A2
2
A1
4
VSS
1
A0
5
SDA
6
SCL
7
WP
8
VCC
E
N
K
M
C
2
8
3
7
-T
1
1
2
D
2
1
2A
A
C
C
DDC_WP
PC_HS
PC_AUD_L
+5V_MULTI
DSUB_SCL
PC_R
CDS3C30GTH
30V
D202
CDS3C30GTH
30V
D203
ADUC30S03010L_AMODIODE 
30V
D200
ADUC30S03010L_AMODIODE 
30V
D201
30V
D206
30V
D205
ADUC30S03010L_AMODIODE 30V
D204
ADUC30S03010L_AMODIODE 
30V
D209
30V
D208
READY
30V
D207
READY
USB_DL_N
USB_DL_P
0
REAR_USB
R229
0
REAR_USB
R230
U
S
B
 D
O
W
N
 S
T
R
E
A
M
U
B
0
1
1
2
3
-4
H
H
S
-4
F
JK205
REAR_USB
1
2
3
4
5
0 .1uF
C203
0.1uF
C200
0.1uF
C201
0.1uF
C202
0.01uF
C205
0.1uF
C204
0.1uF
C206
0.1uF
C207
100R202
100R203
75
R227
220K
R223
READY
220K
R222
READY
12K
R226
12K
R228
75
R211
75
R212
75
R213
4.7K
R214
4.7K
R215
220K
R231
220K
R232
10K
R233
10K
R234
12K
R235
12K
R236
4.7K
R220
4.7K
R221
100
R216
100
R217
100
R218
0.1uF
OCP_READY
C208
MIC2009YM6-TR 
OCP_READYIC202
3ENABLE
2GND
4 FAULT/
1VIN6 VOUT
5 ILIMIT
10uF
OCP_READY
C209
120OHM
OCP_READY
L200
+5V_USB
1K
OCP_READY
R209
4.7K
OCP_READY
R210
0
Non_OCP
R237
10uF6.3VC210USB_DL_N
USB_DL_P
68
R207
68
R208
68pF
C213
68pF
C211
4.7K
R219
READY
0
R200
0
R201
500L201
220uF
16VC212
100uF
16VC214
KDS226
D213
OCP_READY
AAC
C
510
OCP_READY
R238
160
OCP_READY
R206
10KR224
10KR225
IR_OUT
USB
I t ’ s p o s s i b e l t o 2 7 ~ 4 7 o h m
** 1A Des ign
SIDE AV
RS-232C (CI ITEM)
PC EDID
PC
PC SOUND
P i n t o P i n w i t h
EAN43439401
Close to SIDE_USB
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C
opyright LG
 E
lectronics. Inc. A
ll right reserved. 
O
nly for training and service purposes
LG
E
 Internal U
se O
nly
IN
P
U
T
2
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-
47pF
C403
22
IR-OUT
R430
470pF
C404
NON_19_22_26"
KEY1
ZD401
120ohmL406
NON_19_22_26"
ZD402
+5VST_MST
ZD400
500-ohmL410
NON_19_22_26"
IR_OUT
+3.3V_MULTI_MST
10K
IR-OUT
R429
2SC3052
Q405
IR-OUT
E
B
C
500-ohmL411
NON_19_22_26" SUB_SCL
120ohmL402
KEY2
2SC3052
Q404
IR-OUTE
B
C
+5VST_MST
IR
SUB_SDA
0.1uF
C408
NON_19_22_26"
+3.3V_MST
+5VST_MST
0.1uF
C411
NON_19_22_26"
470pF
C412
NON_19_22_26"
120ohmL403
NON_19_22_26"
+3.3V_MULTI_MST
+3.3V_MULTI_MST
+5V_+12V_LCD
0.1uFC407 READY
47uF
16V
C406
0.1uF
16VC414
NON_19_22_26"
+3.3V_MST
KEY2
100pF
50V
C401
19_22_26"
KEY1
100pF
50V
C40019_22_26"
+5V_+12V_LCD
TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4-
+5V_+12V_LCD
+3.3V_MULTI_MST
OPC_EN
E-DIM
OPC_OUT
100pF
50V
C405
19_22_26"
SUB_SCL
100pF
50V
C402
19_22_26"
12507WS-12L
P400
NON_19_22_26"
1
SCL
2
SDA
3
GND
4
KEY1
5
KEY2
6
5V_ST
7
GND
8
WARM_ST(LED_R_BIG)
9
IR
10
GND
11
ST_3.3V(LED_B)
12
POWER_ON(LED_R_SMALL)
13
.
P405
19_22_26"
1
KEY1
2
KEY2
3
GND
4
5V_ST
5
GND
6
IR
7
LED_B
8
LED_R
9
.
BG1608B121F
L400
19_22_26"
BG1608B121F
L401
19_22_26"
BG1608B121F
L408
19_22_26"
BG1608B121F
L405
19_22_26"
4.7K
R420
4.7K
R421
10K
IR-OUT
R427
10K
IR-OUT
R428
47K
IR-OUT
R426
0
R417
NON_19_22_26"
0R400
READY
0
R403
NON_19_22_26"
0R413
READY
0
R402
8B IT o r 52 sha rp
4.7K
10BIT
R401
4.7K
JEIDA
R407
0
R424
VESA100R409
READY
0
READY
R405
0
OPC_ENABLE
R412
470
R435
OPC_ENABLE
SMAW200-03
P404
19_22_26"
1
KEY1
2
KEY2
3
GND
120-ohm
L404
120-ohmL407
NON_19_22_26"
TF05-51S
P401
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
45
46
47
48
49
50
51
52
FF10001-30
P402
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
SMW200-28C
P403
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
LED_R
+3.3V_MST
RT1C3904-T112
Q400
OPC_ENABLE
E
BC 1K
R411
OPC_ENABLE
10K
R404
19_22_26"
2SC3052
Q401
19_22_26"
E
B
C
+3.3V_MULTI_MST
10KR410
19_22_26"
10K
R414
19_22_26"
2SC3052
Q402
19_22_26"
E
B
C
+3.3V_MST
10KR415
19_22_26"
4.7K
R406
19_22_26"
0
READY
R416
0
READY
R418
0
NON 22/27" FHD
R419
0
NON 22/27" FHD
R422
0
NON 22/27" FHD
R423
0
NON 22/27" FHD
R431
0
NON 22/27" FHD
R425
TXCO3+
TXCE1+
TXCO1+
TXCE1-
TXCLKO+
TXCO2-
TXCO2+
TXCO1-
TXCE2+
TXCE2-
TXCLKE+
TXCLKE-
TXCE3+
TXCE3-
TXCE4+
TXCE4-
TXCO3-
TXCO4+
TXCO4-
TXCLKO-
TXCE2-
TXCE2+
TXCE1-
TXCE1+
TXCE0-
TXCE0+
TXCLKE+
TXCLKE-
TXCE3+
TXCE3-
TXCE3-
TXCE3+
TXCLKE-
TXCLKE+
TXCE2-
TXCE2+
TXCE1-
TXCE1+
TXCE0-
TXCE0+
TXCE0-
TXCE0+
TXCO0+
TXCO0-
FHD
X
R402
4.7K10BIT(FHD) X
8BIT(HD)
X
X
0
X
3 2 s h a r p
R401
0
0
X
5 2 s h a r p
8BIT(FHD)
CONTROL KEY
OPC_EABLE
OPC_OUTPUT
External VBR
PANEL WAFER
IR(19/22/26")
(19/22/26")
HD(19/22")
IR(Non 19/22/26)
CONTROL KEY(Non 19/22/26)
*8BIT(FHD):22/27"
HD(26/32/37/42/47")
THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES
SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION.
FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS 
ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR
THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC.
C
opyright LG
 E
lectronics. Inc. A
ll right reserved. 
O
nly for training and service purposes
LG
E
 Internal U
se O
nly
LV
D
S
/ C
T
R
 K
E
Y
Feb., 2009
Printed in KoreaP/NO : MFL60021514
	#EV#