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LCD TV SERVICE MANUAL CAUTION BEFORE SERVICING THE CHASSIS, READ THE SAFETY PRECAUTIONS IN THIS MANUAL. CHASSIS : LP91A MODEL : 26LH20R 26LH20R-MA North/Latin America http://aic.lgservice.com Europe/Africa http://eic.lgservice.com Asia/Oceania http://biz.lgservice.com Internal Use Only Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes LGE Internal Use Only- 2 - CONTENTS CONTENTS .............................................................................................. 2 PRODUCT SAFETY ..................................................................................3 SPECIFICATION ........................................................................................6 ADJUSTMENT INSTRUCTION................................................................11 TROUBLE SHOOTING ............................................................................16 BLOCK DIAGRAM...................................................................................19 EXPLODED VIEW .................................................................................. 20 SVC. SHEET ............................................................................................... Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes LGE Internal Use Only- 3 - SAFETY PRECAUTIONS Many electrical and mechanical parts in this chassis have special safety-related characteristics. These parts are identified by in the Schematic Diagram and Exploded View. It is essential that these special safety parts should be replaced with the same components as recommended in this manual to prevent Shock, Fire, or other Hazards. Do not modify the original design without permission of manufacturer. General Guidance An isolation Transformer should always be used during the servicing of a receiver whose chassis is not isolated from the AC power line. Use a transformer of adequate power rating as this protects the technician from accidents resulting in personal injury from electrical shocks. It will also protect the receiver and it's components from being damaged by accidental shorts of the circuitry that may be inadvertently introduced during the service operation. If any fuse (or Fusible Resistor) in this TV receiver is blown, replace it with the specified. When replacing a high wattage resistor (Oxide Metal Film Resistor, over 1W), keep the resistor 10mm away from PCB. Keep wires away from high voltage or high temperature parts. Before returning the receiver to the customer, always perform an AC leakage current check on the exposed metallic parts of the cabinet, such as antennas, terminals, etc., to be sure the set is safe to operate without damage of electrical shock. Leakage Current Cold Check(Antenna Cold Check) With the instrument AC plug removed from AC source, connect an electrical jumper across the two AC plug prongs. Place the AC switch in the on position, connect one lead of ohm-meter to the AC plug prongs tied together and touch other ohm-meter lead in turn to each exposed metallic parts such as antenna terminals, phone jacks, etc. If the exposed metallic part has a return path to the chassis, the measured resistance should be between 1MΩ and 5.2MΩ. When the exposed metal has no return path to the chassis the reading must be infinite. An other abnormality exists that must be corrected before the receiver is returned to the customer. Leakage Current Hot Check (See below Figure) Plug the AC cord directly into the AC outlet. Do not use a line Isolation Transformer during this check. Connect 1.5K/10watt resistor in parallel with a 0.15uF capacitor between a known good earth ground (Water Pipe, Conduit, etc.) and the exposed metallic parts. Measure the AC voltage across the resistor using AC voltmeter with 1000 ohms/volt or more sensitivity. Reverse plug the AC cord into the AC outlet and repeat AC voltage measurements for each exposed metallic part. Any voltage measured must not exceed 0.75 volt RMS which is corresponds to 0.5mA. In case any measurement is out of the limits specified, there is possibility of shock hazard and the set must be checked and repaired before it is returned to the customer. Leakage Current Hot Check circuit 1.5 Kohm/10W To Instrument’s exposed METALLIC PARTS Good Earth Ground such as WATER PIPE, CONDUIT etc. AC Volt-meter When 25A is impressed between Earth and 2nd Ground for 1 second, Resistance must be less than 0.1 *Base on Adjustment standard IMPORTANT SAFETY NOTICE 0.15uF Ω Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes LGE Internal Use Only- 4 - CAUTION: Before servicing receivers covered by this service manual and its supplements and addenda, read and follow the SAFETY PRECAUTIONS on page 3 of this publication. NOTE: If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication, always follow the safety precautions. Remember: Safety First. General Servicing Precautions 1. Always unplug the receiver AC power cord from the AC power source before; a. Removing or reinstalling any component, circuit board module or any other receiver assembly. b. Disconnecting or reconnecting any receiver electrical plug or other electrical connection. c. Connecting a test substitute in parallel with an electrolytic capacitor in the receiver. CAUTION: A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard. 2. Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device (DVM, FETVOM, etc) equipped with a suitable high voltage probe. Do not test high voltage by "drawing an arc". 3. Do not spray chemicals on or near this receiver or any of its assemblies. 4. Unless specified otherwise in this service manual, clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner, cotton-tipped stick or comparable non-abrasive applicator; 10% (by volume) Acetone and 90% (by volume) isopropyl alcohol (90%-99% strength) CAUTION: This is a flammable mixture. Unless specified otherwise in this service manual, lubrication of contacts in not required. 5. Do not defeat any plug/socket B+ voltage interlocks with which receivers covered by this service manual might be equipped. 6. Do not apply AC power to this instrument and/or any of its electrical assemblies unless all solid-state device heat sinks are correctly installed. 7. Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead. Always remove the test receiver ground lead last. 8. Use with this receiver only the test fixtures specified in this service manual. CAUTION: Do not connect the test fixture ground strap to any heat sink in this receiver. Electrostatically Sensitive (ES) Devices Some semiconductor (solid-state) devices can be damaged easily by static electricity. Such components commonly are called Electrostatically Sensitive (ES) Devices. Examples of typical ES devices are integrated circuits and some field-effect transistors and semiconductor "chip" components. The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity. 1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a commercially available discharging wrist strap device, which should be removed to prevent potential shock reasons prior to applying power to the unit under test. 2. After removing an electrical assembly equipped with ES devices, place the assembly on a conductive surface such as aluminum foil, to prevent electrostatic charge buildup or exposure of theassembly. 3. Use only a grounded-tip soldering iron to solder or unsolder ES devices. 4. Use only an anti-static type solder removal device. Some solder removal devices not classified as "anti-static" can generate electrical charges sufficient to damage ES devices. 5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ES devices. 6. Do not remove a replacement ES device from its protective package until immediately before you are ready to install it. (Most replacement ES devices are packaged with leads electrically shorted together by conductive foam, aluminum foil or comparable conductive material). 7. Immediately before removing the protective material from the leads of a replacement ES device, touch the protective material to the chassis or circuit assembly into which the device will be installed. CAUTION: Be sure no power is applied to the chassis or circuit, and observe all other safety precautions. 8. Minimize bodily motions when handling unpackaged replacement ES devices. (Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device.) General Soldering Guidelines 1. Use a grounded-tip, low-wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500°F to 600°F. 2. Use an appropriate gauge of RMA resin-core solder composed of 60 parts tin/40 parts lead. 3. Keep the soldering iron tip clean and well tinned. 4. Thoroughly clean the surfaces to be soldered. Use a mall wire- bristle (0.5 inch, or 1.25cm) brush with a metal handle. Do not use freon-propelled spray-on cleaners. 5. Use the following unsoldering technique a. Allow the soldering iron tip to reach normal temperature. (500°F to 600°F) b. Heat the component lead until the solder melts. c. Quickly draw the melted solder with an anti-static, suction- type solder removal device or with solder braid. CAUTION: Work quickly to avoid overheating the circuit board printed foil. 6. Use the following soldering technique. a. Allow the soldering iron tip to reach a normal temperature (500°F to 600°F) b. First, hold the soldering iron tip and solder the strand against the component lead until the solder melts. c. Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil, and hold it there only until the solder flows onto and around both the component lead and the foil. CAUTION: Work quickly to avoid overheating the circuit board printed foil. d. Closely inspect the solder area and remove any excess or splashed solder with a small wire-bristle brush. SERVICING PRECAUTIONS Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes LGE Internal Use Only- 5 - IC Remove/Replacement Some chassis circuit boards have slotted holes (oblong) through which the IC leads are inserted and then bent flat against the circuit foil. When holes are the slotted type, the following technique should be used to remove and replace the IC. When working with boards using the familiar round hole, use the standard technique as outlined in paragraphs 5 and 6 above. Removal 1. Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts. 2. Draw away the melted solder with an anti-static suction-type solder removal device (or with solder braid) before removing the IC. Replacement 1. Carefully insert the replacement IC in the circuit board. 2. Carefully bend each IC lead against the circuit foil pad and solder it. 3. Clean the soldered areas with a small wire-bristle brush. (It is not necessary to reapply acrylic coating to the areas). "Small-Signal" Discrete Transistor Removal/Replacement 1. Remove the defective transistor by clipping its leads as close as possible to the component body. 2. Bend into a "U" shape the end of each of three leads remaining on the circuit board. 3. Bend into a "U" shape the replacement transistor leads. 4. Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the "U" with long nose pliers to insure metal to metal contact then solder each connection. Power Output, Transistor Device Removal/Replacement 1. Heat and remove all solder from around the transistor leads. 2. Remove the heat sink mounting screw (if so equipped). 3. Carefully remove the transistor from the heat sink of the circuit board. 4. Insert new transistor in the circuit board. 5. Solder each transistor lead, and clip off excess lead. 6. Replace heat sink. Diode Removal/Replacement 1. Remove defective diode by clipping its leads as close as possible to diode body. 2. Bend the two remaining leads perpendicular y to the circuit board. 3. Observing diode polarity, wrap each lead of the new diode around the corresponding lead on the circuit board. 4. Securely crimp each connection and solder it. 5. Inspect (on the circuit board copper side) the solder joints of the two "original" leads. If they are not shiny, reheat them and if necessary, apply additional solder. Fuse and Conventional Resistor Removal/Replacement 1. Clip each fuse or resistor lead at top of the circuit board hollow stake. 2. Securely crimp the leads of replacement component around notch at stake top. 3. Solder the connections. CAUTION: Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures. Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or "lift-off" the board. The following guidelines and procedures should be followed whenever this condition is encountered. At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board. (Use this technique only on IC connections). 1. Carefully remove the damaged copper pattern with a sharp knife. (Remove only as much copper as absolutely necessary). 2. carefully scratch away the solder resist and acrylic coating (if used) from the end of the remaining copper pattern. 3. Bend a small "U" in one end of a small gauge jumper wire and carefully crimp it around the IC pin. Solder the IC connection. 4. Route the jumper wire along the path of the out-away copper pattern and let it overlap the previously scraped end of the good copper pattern. Solder the overlapped area and clip off any excess jumper wire. At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins. This technique involves the installation of a jumper wire on the component side of the circuit board. 1. Remove the defective copper pattern with a sharp knife. Remove at least 1/4 inch of copper, to ensure that a hazardous condition will not exist if the jumper wire opens. 2. Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern. 3. Connect insulated 20-gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side. Carefully crimp and solder the connections. CAUTION: Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges. Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes LGE Internal Use Only- 6 - SPECIFICATION NOTE : Specifications and others are subject to change without notice for improvement. 4. Electrical specification 4.1 General Specification 1. Application range This spec sheet is applied to LCD TV used LP91A chassis. 2. SpecificationEach part is tested as below without special appointment. 1) Temperature : 25±5ºC (77±9ºF), CST : 40±5ºC 2) Relative Humidity : 65±10% 3) Power Voltage : Standard input voltage(100~240V@50/60Hz) * Standard Voltage of each products is marked by models. 4) Specification and performance of each parts are followed each drawing and specif ication by part number in accordance with BOM. 5) The receiver must be operated for about 5 minutes prior to the adjustment. 3. Test method 1) Performance: LGE TV test method followed 2) Demanded other specification - Safety: CE, IEC specification - EMC : CE, IEC No Item Specification Measurement Remark 1 Screen Size 26” wide Color Display Module Resolution: 1366*768 2 Aspect Ratio 16:9 3 LCD Module 26” TFT WXGA LCD HD 4 Operating Environment Temp.: 0 ~ 40 deg Humidity : 0 ~ 80 % 5 Storage Environment Temp.: -20 ~ 60 deg Humidity : 0~ 85 % 6 Input Voltage AC100-240V~, 50/60Hz ≤ 120 W 26” HD 7 LDC Module HD 626 x 373 x 44.1 with inverter (Maker : LGD) 0.1405 x 0.4215 12 EEFL Coating 3H Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes No. Item Min. Typ. Max. Unit Maker Remark 1. Luminance 360 450 cd/m2 (W/O PC mode) 2. VIew angle (R/L, U/D) 178/ 178 degree LGD CR > 10 3. Color Coordinates White Wx Typ 0.279 Typ LGD 26”(HD) Wy -0.03 0.292 +0.03 LC260WXN-SBA1 RED Xr 0.637 Yr 0.333 Green Xg 0.290 Yg 0.607 Blue Xb 0.145 Yb 0.061 4. Contrast ratio 700:1 1000:1 LGD 26”(HD) 5. Luminance Variation 1.3 - 7 - LGE Internal Use Only 5. Chroma& Brightness (Optical) 5.1. LCD Module the Color Coordinates check condition - 50cm from the surface, Full White Pattern - Picture mode Vivid 8. Component Video Input (Y, PB, PR) No Specification Remark Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz) 1 720* 480 15.73 59.94 13.500 SDTV, DVD 480I( 525I) 2 720* 480 15.75 60.00 13.514 SDTV, DVD 480I( 525I) 3 720* 576 15.625 50.00 13.500 SDTV, DVD 576I( 625I) 50Hz 4 720* 480 31.47 59.94 27.000 SDTV 480P 5 720* 480 31.50 60.00 27.027 SDTV 480P 6 720* 576 31.25 50.00 27.000 SDTV 576P 50Hz 7 1280* 720 44.96 59.94 74.176 HDTV 720P 8 1280* 720 45.00 60.00 74.250 HDTV 720P 9 1280* 720 37.50 50.00 74.25 HDTV 720P 50Hz 10 1920* 1080 28.125 50.00 74.250 HDTV 1080I 50Hz, 11 1920* 1080 33.72 59.94 74.176 HDTV 1080I 12 1920* 1080 33.75 60.00 74.25 HDTV 1080I 13 1920* 1080 56.25 50 148.5 HDTV 1080P 14 1920* 1080 67.432 59.94 148.350 HDTV 1080P 15 1920* 1080 67.5 60.00 148.5 HDTV 1080P Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes - 8 - LGE Internal Use Only No Specification Remark Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz) 1 640* 350 31.468 70.09 25.17 EGA 2 720* 400 31.469 70.09 28.32 DOS 3 640* 480 31.469 59.94 25.17 VESA( VGA) 4 800* 600 37.879 60.317 40 VESA( SVGA) 5 1024* 768 48.363 60.004 65 VESA( XGA) 6 1280* 768 47.776 59.87 79.5 VESA( WXGA) 7 1360* 768 47.72 59.799 84.75 VESA( WXGA) 8 1280* 1024 63.668 59.895 109.00 XGA Only FHD Model 9 1920* 1080 66.587 59.934 138.50 WUXGA(Reduced Blanking) Only FHD Model 9. RGB 9.1 Analog PC, RGB- DTV –NOT SUPPORT 10. HDMI Input 10.1 PC –Spec. out but it can be shown the picture at only HDMI/ DVI IN 1 via DVI to HDMI Cable) No Resolution H-freq(kHz) V-freq.(Hz) Pixel clock(MHz) Proposed Remark 1 640 x 480 31.469 59.94 25.17 VESA( VGA) 2 800 x 600 37.879 60.317 40.00 VESA( SVGA) 3 1024 x 768 48.363 60.004 65.00 VESA( XGA) 4 1280 x 768 47.776 59.87 79.5 VESA( WXGA) 5 1360 x 768 47.72 59.799 84.62 VESA( WXGA) 6 1366 x 768 47.7 60.00 84.62 WXGA 7 1280 x 1024 63.595 60.00 108.875 SXGA 8 1920 x 1080 66.647 59.988 138.625 WUXGA 10.2 DTV Mode No Specification Remark Resolution H-freq(kHz) V-freq(Hz) Pixel Clock(MHz) 1 720 x 480 15.73 59.94 13.500 SDTV, DVD 480I(525I) 2 720 x 480 15.75 60.00 13.514 SDTV, DVD 480I(525I) Spec. out 3 720 x 576 15.625 50.00 13.500 SDTV, DVD 576I(625I) 50Hz but display. 4 720 x 480 31.47 59.94 27 SDTV 480P 5 720 x 480 31.5 60.00 27.027 SDTV 480P 6 720 x 576 31.25 50.00 27 SDTV 576P 7 1280 x 720 44.96 59.94 74.176 HDTV 720P 8 1280 x 720 45 60.00 74.25 HDTV 720P 9 1280 x 720 37.5 50.00 74.25 HDTV 720P 10 1920 x 1080 28.125 50.00 74.25 HDTV 1080I 11 1920 x 1080 33.72 59.94 74.176 HDTV 1080I 12 1920 x 1080 33.75 60.00 74.25 HDTV 1080I 13 1920 x 1080 56.25 50.00 148.5 HDTV 1080P 14 1920 x 1080 67.432 59.94 148.350 HDTV 1080P 15 1920 x 1080 67.5 60.00 148.5 HDTV 1080P 16 1920 x 1080 27 24.00 74.25 HDTV 1080P 17 1920 x 1080 33.75 30.00 74.25 HDTV 1080P 1) Gap between Front Frame /Back cover and Middle Cabinet 2) Gap between Front Frame /Middle Cabinet - 9 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes Top View Back Cover Front Frame Middle Cabinet "b "b Gap b between Front Frame (Back cover) and Middle Cabinet -> 0 † b † B (Side gap) Gap a between Front Frame and Middle Cabine -> 0 † a † A (Side gap) "b "a Gap a between Front Frame and Middle Cabine -> 0 † a † A (Left/ Right gap) 3) Gap between Back Cover and Side AV Back View Side View Side AV Back Cover Gap f between Back Cover and Side AV -> 0 † f † 1.0 Gap g between Back Cover and Side AV -> 0 † g † 1.0 11. Mechical spec. No Item Min Typ Max Unit 1. C/ A + B/ C top gap 0.5 1 1.5 mm 2. C/ A + B/ C side gap 0.5 1 1.5 mm 3. C/ A + Deco Front gap( ONE SIDE). 0.8 1 1.2 mm *Active area 1. Active area of LCD PANEL is in bezel of cabinet 2. Interval between active area and bezel |A-B|< 2.0 mm ,|C-D|< 2.0 mm A:Interval between left of active area and bezel B:Interval between right of active area and bezel C:Interval between top of active area and bezel D:Interval between bottom of active area and beze 4)Gap between Back Cover and Side AV - 10 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes Side View "h" Control Braket Back Cover Gap h between Back Cover and Control Bracket -> 0 † h † 0.8 C B D A Active Area Bezel Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes LGE Internal Use Only- 11 - ADJUSTMENT INSTRUCTION 1. Application Range This specification sheet is applied to all of the LCD TV, LP91A/B/C/D chassis. 2. Specification 1) Because this is not a hot chassis, it is not necessary to use an isolation transformer. However, the use of isolation transformer will help protect test instrument. 2) Adjustment must be done in the correct order. 3) The adjustment must be performed in the circumstance of 25 ±5 °C of temperature and 65±10% of relative humidity if there is no specific designation. 4) The input voltage of the receiver must keep 100~220V, 50/60Hz. 5) Before adjustment, execute Heat-Run for 5 minutes at RF no signal. 3. Adjustment items 3.1. PCB assembly adjustment items (1) Download the MSTAR main software (IC800, Mstar ISP Utility) 1) Using D/L Jig 2) Using USB Memory Stick. (2) ADC Calibration – RGB / Component (3) Input Tool-Option/Area option. (4) Check SW Version. 4. PCB assembly adjustment method 4.1. Mstar Main S/W program download 4.1.1. Using D/L Jig (1) Preliminary steps 1) Connect the download jig to D-sub(RGB) jack (2) Download steps 1) Execute ‘ISP Tool’ program, the main window(Mstar ISP utility Vx.x.x) will be opened 2) Click the “Connect” button and confirm “Dialog Box” 3) Click the “Config.” button and Change speed I2C Speed setting : 350Khz~400Khz 4) Read and write bin file. Click “(1)Read” tab, and then load download file(XXXX.bin) by clicking “Read”. - LH20/ LH30 1 Filexxx.bin 1 Filexxx.bin 5) Click “(2)Auto” tab and set as below 6) Click “(3)Run”. 7) After downloading, you can see the “(4)Pass” message. 4.1.2. Using the Memory Stick * USB download : Service Mode 1) Insert the USB memory stick to the ISB port. 2) Automatically detect the SW Version.-> S/W download process is executed automatically. 3) Show the message “Copy the file from the Memory” 4) After Finished the Download, Automatically DC Off -> On 5) Check The update SW Version. 4.2. Adjust tool/area option. Adjust tool/area option refer to the BOM. 4.3. Adjust tool/area option. Adjust tool/area option refer to the BOM. 4.4. EDID D/L method Recommend that don’t connect HDMI and RGB(D-SUB) cable when downloading the EDID. If not possible, recommend that connect the MSPG equipment. There are two methods of downloading the edid data 4.4.1. 1st Method EDID datas are automatically downloaded when adjusting the Tool Option2. Automatically downloaded when pushing the enter key after adjusting the tool option2. It takes about 2seconds. 4.4.2. 2nd Method * Caution : Must be checked that the tool option is right or not. If tool option is wrong, hdmi edid data could not be downloaded well. 1) Press the ADJ key 2) Move to the EDID D/L and Press the right direction key(G) 3) Press the right direction key(G) at Start. 4) After about a few seconds, appear “OK”, then compele. 4.4.3. RS-232C command Method (1) Command : AE 00 10 * Caution Don’t connect HDMI and RGB(D-SUB) cable when downloading the EDID. If the cables are connected, Downloading of edid could be failed. - 12 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes 1 Filexxx.bin 4.4.4. EDID data (1) HD MODEL <Analog(RGB): 128bytes> <HDMI 1 : 256Bytes> <HDMI 2 : 256Bytes> 4.5. ADC Calibration 4.5.1. ADC Calibration - Component (Using External pattern) (1) Required Equipments - Remote controller for adjustment - MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator (2) Process 1) Change the Input to Component1 or 2 mode. 2) Input the Component 480i@60Hz 100% Color Bar YPbPr signal into Component1 or 2. (MSPG-925F Model: 209 / Pattern: 65 ) 3) Press ADJ key on R/C for adjustment. 4) Enter Password number. Password is “0 0 0 0”. 5) Select “0. ADC calibration : Component” by using D/E (CH +/-) and press ENTER(A). 6) ADC adjustment is executed automatically . 7) When ADC adjustment is finished, this OSD appear 4.5.2. ADC Calibration - RGB (Using External pattern) (1) Required Equipments - Remote controller for adjustment - MSPG-925F/MSPG-1025/MSPG-3233 Pattern Generator (2) Process 1) Change the Input to RGB mode.. 2) Input the PC 1024x768@60Hz Horizontal Color Bar signal into RGB. (MSPG-925F Model: 60 / Pattern: 65 ) 3) Press ADJ key on R/C for adjustment. 4) Enter Password number. Password is “0 0 0 0”. 5) Select “0. ADC calibration : RGB” by using D/E(CH +/-) and press ENTER(A). 6) ADC adjustment is executed automatically . 7) When ADC adjustment is finished, this OSD appear - 13 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes OK OK 4.6. Input Tool-Option, Area Option. ## TOOL Option, Area Option change and AC off Before PCBA check, you have to change the Tool option, Area option and have to AC off/on (Plug out and in) (If missing this process, set can operate abnormally) 4.6.1. Profile : Must be changed the option value because being different with some setting value depend on module maker, inch and market 4.6.2. Equipment : adjustment remote control. 4.6.3. Adjustment method The input methods are same as other chassis.(Use IN-START Key on the Adjust Remocon.) (If not changed the option, the input menu can differ the model spec.) * Refer to Job Expression of each main chassis ass’y (EBTxxxxxxxx) for Option value * Never push the IN-STOP KEY after completing the function inspection. 4.7. Check SW Version (1) Method 1) Push In-star key on Adjust remote-controller. 2) SW Version check Check “SW VER : V3.xx” – LH20 5. White Balance adjstment 5.1. Overview (1) Purpose : Adjust the color temperature to reduce the deviation of the module color temperature. (2) Principle : To adjust the white balance without the saturation, Fix the one of R/G/B gain to 192 (default data) and decrease the others. (3) Adjustment mode : Three modes – Cool / Medium / Warm 5.2. Required Equipment (1) Remote controller for adjustment (2) Color Analyzer : CA100+ or CA-210 or same product - LCD TV (ch:9) (should be used in the calibrated ch by CS-1000) (3) Auto W/B adjustment instrument(only for Auto adjustment) 5.3. Connecting diagram of equipment for measuring (For automatic adjustment) * LP91A~D Support RS-232C & I2C DDC Communication-White Balance Mode. (1) Enter the adjustment mode of DDC - Set command delay time : 50ms - Enter the DDC adjustment mode at the same time heat- run mode when pushing the power on by power only key - Maintain the DDC adjustment mode with same condition of Heat-run => Maintain after AC off/on in status of Heat- run pattern display) (2) Release the DDC adjustment mode - Release the adjust mode after AC off/on or std-by off/on in status of finishing the Hear-run mode - Release the Adjust mode when receiving the aging off command(F3 00 00) from adjustment equipment. - Need to transmit the aging off command to TV set after finishing the adjustment. - Check DDC adjust mode release by exit key and release DDC adjust mode) (3) Enter the adjust mode of white balance) - Enter the white balance adjustment mode with aging command (F3, 00, FF) * Luminance min value is 150cd in the Cool/Medium/Warm mode(For LCD) 5.3. Adjustment of White Balance (for Manual adjustment) (1) Color analyzer(CA100+, CA210) should be used in the calibrated ch by CS-1000 (2) Operate the zero-calibration of the CA100+ or CA-210, then stick sensor to the module when adjusting. (3) For manual adjustment, it is also possible by the following sequence. 1) Select white pattern of heat-run by pressing “POWER ON” key on remote control for adjustment then operate heat run longer than 15 minutes. (If not executed this step, the condition for W/B may be different.) 2) Push “Exit” key. 3) Change to the AV mode by remote control. 4) Input external pattern (85% white pattern) 5) Push the ADJ key -> Enter “0000” (Password) 6) Select “3. W/B ADJUST” 7) Enter the W/B ADJUST Mode 8) Stick the sensor to the center of the screen and select each items (Red/Green/Blue Gain and Offset) using D/E(CH +/-) key on R/C.. 9) Adjust R/ G/ B Gain using F/G(VOL +/-) key on R/C. 10) Adjust three modes all (Cool / Medium / Warm) : Fix the one of R/G/B gain and change the others 11) When adjustment is completed, Enter “COPY ALL”. 12) Exit adjustment mode using EXIT key on R/C. - 14 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes * CASE First adjust the coordinate far away from the target value(x, y). 1. x, y > target i) Decrease the R, G. 2. x, y < target i) First decrease the B gain, ii) Decrease the one of the others. 3. x > target, y < target i) First decrease B, so make y a little more than the target. ii) Adjust x value by decreasing the R 4. x < target, y > target i) First decrease B, so make x a little more than the target. ii) Adjust x value by decreasing the G (4) Standard color coordinate and temperature when using the CA100+ or CA210 equipment To check the Coordinates of White Balance, you have to measure at the below conditions. Picture Mode : User 1 Dynamic Contrast : Off Dynamic Colour : Off (If you miss the upper condition, the coordinates of W/B can be lower than the spec.) - 15 - LGE Internal Use OnlyCopyright LG Electronics. Inc. All right reserved. Only for training and service purposes Coordinate Mode x y Temp uv∆ Cool 0.276±0.002 0.283±0.002 11000K 0.000 Medium 0.285±0.002 0.293±0.002 9300K 0.000 Warm 0.313±0.002 0.329±0.002 6500K 0.003 Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes LGE Internal Use Only- 16 - TROUBLESHOOTING No power (LED indicator off) Check 24V, 12V, 5,2V of PowerB/D Check short of Main B/D or Change Power B/D Pass Check Output of IC1001, IC1003, IC1007 Check P307 Connector Change LED Assy : [A] PROCESS Fail Fail Pass Pass Check LED Assy Change IC1002,, Q1003 Pass Check short of IC1001, IC1003, IC1007 Fail Re-soldering or Change defect part of IC1001, IC1003, IC1007 Fail No Raster [B]: Process Check LED status On Display Unit Repeat A PROCESS Pass Fail Check Output of IC802 Change IC802 Fail Change Inverter Connector Or InverterFail Pass Fail Pass Change Module Fail Check LVDS Cable Pass Check Panel Link Cable Or Module Change Panel Link Cable Or Module Check Inverter Connector Or Inverter Pass Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes LGE Internal Use Only- 17 - No Raster on PC Signal Check Input source Cable and Jack Pass Re-soldering or Change the defect part Pass Check the Input/Output Of IC100 Fail Re-soldering or Change the defect part, Check RGB EDID Data Repeat [A], & [B] Process Pass Check the Input/Output Of J104 Fail Pass Check the Input/Output Of IC800 Fail Re-soldering or Change the defect part Pass No Raster on COMMPONENT Signal Check Input source Cable And Jack Pass Re-soldering or Change the defect part Pass Check the Input/Output Of IC800 Fail Re-soldering or Change the defect part Repeat [A], & [B] Process Check The Input/Output Of JK101 Fail Pass No Raster on HDMI Signal Check Input source Cable And Jack Pass Check the Input/Output Of JK301, JK302, JK303 Fail Re-soldering or Change the defect part Pass Pass Check the Input/Output Of IC300, IC301, JK302 Fail Re-soldering or Change the defect part Check HDMI EDID Data Re-download HDCP Pass Pass Check the Input/Output Of IC800 Fail Re-soldering or Change the defect part Repeat [A], & [B] Process Copyright LG Electronics. Inc. All right reserved. Only for training and service purposes LGE Internal Use Only- 18 - No Raster On AV (Video, S-Video)Signal No Signal On TV(RF) Signal Check Input source Cable And Jack Pass Check Input source Cable And Jack Pass Check The Input/Output Of JK101, JK201 Pass Re-soldering or Change the defect part Pass Fail Pass Repeat [A], & [B] Process Check the Input/Output Of IC800 Fail Re-soldering or Change the defect part Pass Check The Input/Output Of TU500 Pass Re-soldering or Change the defect part Pass Fail Check the Input/Output Of IC800 Fail Re-soldering or Change the defect part Repeat [A], & [B] Process No Sound Check The Input Sourse. Check The Input/Output Of IC600. Re-soldering or Change the defect part.Fail Pass Pass Check The Speaker. Change Speaker. Fail Check The Speaker Wire. Pass Change The Source Input. Fail C opyright LG E lectronics. Inc. A ll right reserved. O nly for training and service purposes LG E Internal U se O nly - 19 - B L O C K D IA G R A M RGB_PC PC_Audio TV (RF) COMP1 HDMI1 HDMI2 RS232 TX 232C Driver ST3232C Tx/ Rx : 15Vpp PC_R/ G/ B/ HS/ VS PC_Audio_L/ R :700mVrms MNT_OUT: 1Vpp SIDE_V :1Vpp SIDE_L/ SIDE_R :500mVrms DDR2(512MB) L_SPK_OUT R_SPK_OUT EEPROM 24C02 Comp1_L/ R :500mVrms TUNER AV1_VIN: 1Vpp AV11_LIN/ RIN :500mVrms PWM NTP3100L MNT_OUT MNT_LOUT/ ROUT: 500mVrms AV2 (Side AV) MAIN SCALER TXD / RXD : 5V Dig ital COMP1_Y/ Pb/ Pr: 1/ 0.7Vpp COMP2_Y/ Pb/ Pr: 1/0.7Vpp IR HDMI_DATA_1 HDMI_DATA_2 HDMI1_SCL/ SDA OUT_E_TX_CLK OUT_E_TX_E OUT_E_TX_D OUT_E_TX_C OUT_E_TX_B OUT_E_TX_A TU_MAIN S I F COMP1_Y/ Pb/ Pr 1/ 0.7Vpp AV1_VIN PC_Audio_L/ R COMP1_LIN/ RIN L_CH R_CH L V D S c o n n e c to r TU_MAIN SUB_SCL SDA EEPROM 24C02 EEPROM 24C02 SIF AV1_LIN/ RIN MNT_L/ R OUT AV1 MNT_OUT Comp2_L/ R :500mVrms COMP2_Y/ Pb/ : 1/ 0.7Vpp COMP2_LIN/ RIN COMP2 OUT_O_TX_CLK OUT_O_TX_E OUT_O_TX_D OUT_O_TX_C OUT_O_TX_B OUT_O_TX_A PC_R/ G/ B/ HS/ VS HDM 2_SCL/ SDA PC_SCL/ SDA MNT_VOUT AV2_VIN AV2_LIN/ RIN IIS_OUT USB USB_DN/ PN AUDIO AMP HDMI3_SCL/ SDAEEPROM 24C02 HDMI_DATA_3 TMDS TMDS TMDS HDMI3 USB For D/ L EEPROM(256K) Serial Flash (8MByte) RGB_PC PC_Audio TV (RF) COMP1 HDMI1 HDMI2 RS232 TX 232C Driver ST3232C – PC_R/ G/ B/ HS/ VS PC_Audio_L/ R :700mVrms MNT_OUT: 1Vpp SIDE_V :1Vpp SIDE_L/ SIDE_R :500mVrms DDR2(512MB) EEPROM 24C02 Comp1_L/ R :500mVrms TUNER AV1_VIN: 1Vpp AV11_LIN/ RIN :500mVrms PWM NTP3100L MNT_OUT MNT_LOUT/ ROUT: 500mVrms AV2 (Side AV) MAIN SCALER TXD / RXD : 5V Dig ital COMP1_Y/ Pb/ Pr: 1/ 0.7Vpp COMP2_Y/ Pb/ Pr: 1/0.7Vpp HDMI_DATA_1 HDMI_DATA_2 _ OUT_E_TX_CLK– OUT_E_TX_ – OUT_E_TX_ – OUT_E_TX_C– OUT_E_TX_B– OUT_E_TX_A– TU_MAIN S I F COMP1_Y/ Pb/ P : 1/ 0.7Vpp AV1_VIN PC_Audio_L/ R COMP1_LIN/ RIN L_CH R_CH L V D S c o n n e c to r TU_MAIN / EEPROM 24C02 EEPROM 24C02 SIF AV1_LIN/ RIN MNT_L/ R OUT AV1 MNT_OUT Comp2_L/ R :500mVrms COMP2_Y/ Pb/Pr 1/ 0.7Vpp COMP2_LIN/ RIN COMP2 OUT_O_TX_C – OUT_O_TX_E– OUT_O_TX_D– OUT_O_TX_C– OUT_O_TX_B– OUT_O_TX_A– PC_R/ G/ B/ HS/ VS PC_SCL/ SDAPC_SCL/ SDA MNT_VOUT AV2_VIN AV2_LIN/ RIN IIS_OUT USB USB_DN/ PN AUDIO AMP HDMI3_SCL/ SDAHDMI3_SCL/ SDAEEPROM 24C02 HDMI_DATA_3 TMDS TMDS TMDS HDMI3 USB For D/ L EEPROM(256K) Serial Flash (8MByte) C opyright LG E lectronics. Inc. A ll right reserved. O nly for training and service purposes LG E Internal U se O nly - 20 - 300 200 200T 200N 800 804 540 803 805 400 900 510 310 500 120 121 802 801 550 530 E X P L O D E D V IE W M any electrical and m echanical parts in this chassis have special safety-related characteristics. T hese parts are identified by in the S chem atic D iagram and E X P LO D E D V IE W . It is e sse n tia l th a t th e se sp e cia l sa fe ty p a rts sh o u ld b e re p la ce d w ith th e sa m e co m p o n e n ts a s recom m ended in this m anual to prevent X -R A D IA T IO N , S hock, F ire, or other H azards. D o not m odify the original design w ithout perm ission of m anufacturer. IM P O R T A N T S A F E T Y N O T IC E A2 LV1 A10 MULTI_PW_SW 10R859 56AR 81 2 SUB_SDA HP D_ M ST _3 +1.8V_DDR COMP2_PB RT1C3904-T112 Q802 E BC DDR2_DQM0 10 0 R 82 5 0.047uFC828 KE Y1 RL _O N MX25L6405DMI-12G IC802 3 NC_1 2 VCC 4 NC_2 1 HOLD 6 NC_4 5 NC_3 7 CS 8 SO/SIO1 9WP/ACC 10GND 11NC_5 12NC_6 13NC_7 14NC_8 15SI.SIO0 16SCLK 0.01uF C864 0. 1u F C 88 2 I2 S_ SC K TMDS2_RX2-0.1uFC833 I2 S_ M CL K US B_ DN 100R882 MAIN_SIF PC_G 10 0 R 80 24 33R844 10 R 80 1 HD M I3 _S ID E 0.047uFC830 PA NE L_ ST AT US TMDS2_RX0+ MNT_VOUT_T TM DS 3_ RX 0+ 0.1uFC842 SW_RESET RX D 0 .01uF C858 TMDS2_RX2+ +3.3V_MULTI_MST 0. 1u F C 81 3 12 M Hz X8 01 10R874 1MR 83 9 4 .7uF C812 RL_ON M_ SD A DD C_ SD A3 +3.3V_MULTI_MST +3.3V_MST MUTE_LINE EEP_SCL E- DI M SIDE_RIN 10R862 56 AR805 DDR2_DQM1 10 R 84 8 HD M I3 _S ID E EE P_ SC L CE C_ C 10uF C866 0.01uF C860 47R834 56AR 81 3 TM DS 3_ RX 1+ SY S_ RE SE T SP I_ C Z I2 S_ SD O 0.1uFC815 22KR842 TMDS2_RXC+ DD C_ SC L1 0.047uFC837 PO W ER _S W 47R832 TMDS2_RXC- +5VST_MST 0.1uFC848 56 AR810 10 R 84 1 HD M I3 _S ID E 0.1uFC838 +1.2V_VDDC_MST +3.3V_MULTI_MST JTP-1127WEM SW800 1 2 43 MNT_L_AMP 0.1uF C811 MNT_VOUT DD R2 _C AS Z PANEL_ON 1000pFC835 0.1uFC849 PC_B TM DS 3_ RX 2+ +3.3V_MULTI_MST 0.047uFC829 DD C_ SC L3 DD R2 _B A1 DISP_EN/VAVS_ON DD R2 _R AS Z DDR2_D[0-15] TM DS 3_ RX 0- 10R854 COMP2_Y 33AR 81 8 0.047uFC832 PC _A UD _L PC _V S CV BS _L IN SPI_DI 402R807 READY 0. 1u F C 88 3 DD R2 _B A0 EEP_SCL 10 R 82 0 HD M I3 _S ID E 0 .01uF C859 +3.3V_MULTI_MST DDR2_DQS0M SIDE_LIN SIDE_V 0.047uFC831 0.01uF C803 TMDS2_RX1+ +1.8V_DDR DD C_ SD A1 SUB_SCL DS UB _S DA 10R890 100R881 CAT24WC08W-TIC803 3 A2 2 A1 4 VSS 1 A0 5 SDA 6 SCL 7 WP 8 VCC DD R2 _C KE +12V_AUDIO SP I_ CL K +3.3V_MULTI_MST DDR2_DQS1M 0.01uF C807 KDS181 D803 US B_ DP +3.3V_MST 10 0 R 80 25 +3.3V_MULTI_MST 56 AR809 I-D IM SPI_CZ 0. 1u F C 80 8 0.1uFC804 56 R 85 2IR 0.01uFC841 EE P_ SD A DDR2_A[0-12] +3.3V_MULTI_MST 10 R 82 2 HD M I3 _S ID E CVBS_VIN 10R851 DDR2_DQS1P 10 R 82 3 HD M I3 _S ID E TM DS 3_ RX C- MNT_VOUT_T TMDS2_RX0- +3.3V_MULTI_MST DDR2_DQS0P 10 R 82 1 HD M I3 _S ID E 10R869 47R837 DDR2_MCLKZ DD R2 _W EZ TX D 56 AR806 0.047uFC834 EEP_SDA TMDS1_RXC+ 24LC256-I/SM IC801 3 A2 2 A1 4 VSS 1 A0 5 SDA 6 SCL 7 WP 8 VCC CO M P2 _R M _S CL +3.3V_MULTI_MST PC _H S TMDS1_RX2- 0.01uFC850 +3.3V_MULTI_MST TM DS 3_ RX C+ 47uF25V C870 +3.3V_MULTI_MST 470R835 10R891 KDS181 D802 TV_MAIN 10 00 pF C 81 8 COMP2_PR RT1C3904-T112 Q804 NON 19_22" E B C 0.1uF C867 22KR845 10 0 R 80 26 TM DS 3_ RX 1- P_24V_SMALL_15V 0. 01 uF C 84 0 2.2uFC861 HPD_MST_1 10R873 10R880 SPI_DO PC _A UD _R 0.01uFC810 56AR 81 4 +1.2V_VDDC_MST 10 0 R 80 23 TMDS2_RX1- DD C_ SC L2 10R858 10R892 TMDS1_RX1+ 10R871 TMDS1_RX2+ EEP_SDA 56AR 80 0 10 R 80 5 HD M I3 _S ID E KDS181 D801 DD R2 _O DT TMDS1_RXC- SP I_ D I I2 S_ W S DDR2_MCLK 0.047uFC826 TMDS1_RX0- 10R872 MNT_R_AMP 10R879 HPD_MST_2 0.1uFC853 0.01uFC839 DS UB _S CL 0 .01uF C865 CO M P2 _L 10 uF 16 V C 80 9 +1.8V_DDR 0.01uF C862 +1.2V_VDDC_MST TMDS1_RX1- 4. 7u F C 82 0 10 0 R 82 4 10 0 R 82 9 KE Y2 56AR 81 5 TMDS1_RX0+ 0.01uF C857 CV BS _R IN 2.2uFC856 0.1uFC869 +5VST_MST 0.1uF C814 PC_R SPI_CLK 33R843 0. 1u F C 84 4 10R856 TM DS 3_ RX 2- 0. 01 uF C 87 6 DD C_ SD A2 SP I_ DO P_12V_SMALL_15V +5VST_MST POWER_DET PO W ER _D ET RT1C3904-T112 Q803 E B C +5VST_MST SYS_RESET 10 0 R 80 12 0 .01uF C877 0.01uF C878 0.01uF C879 TX D RX D 0 .1 uF C 86 3 ISA1530AC1 Q800 EB C ISA1530AC1 Q801 E BC 2.2uF 16VC8000READY +3.3V_MULTI_MST 0 R 80 6 0 R 87 0 S_VIDEO_DET SIDE_Y SIDE_C DDC_WP OPC_EN 4.7K R877 4.7K R8004 4.7K R817 470 R809 47 R8041 220R808 68 R810 0 R800 READY 0 R8001 390R840 47R814 47R816 47R818 47R838 47R833 47R836 470R803 47R804 47R815 47R897 47R802 47R831 47R857 47R830 47R875 47R876 100R846 100R847 1 0 0 R 8 0 3 9 H D M I3 _ S ID E 1 0 0 R 8 0 4 0 H D M I3 _ S ID E 4.7K R863 4.7K R864 100R8042 1KR8038 1KR8018 4.7KR865 4.7KR866 1K R 86 7 1K R 86 8 10 0 R 80 21 10 0 R 80 22 10 0 R 85 0 10 0 R 84 9 10 0 R 89 5 0 RE AD Y R 80 17 0 RE AD Y R 80 16 0 R 80 33 RE AD Y 0 R 80 34 0 R 80 35 10K R8020 10K R8003 0.047uFC800 0.047uFC801 0.047uFC827 0.047uFC825 0.047uFC847 0.047uFC845 0.047uFC843 0.047uFC836 0.1uFC868 1000pFC846 1K R884 READY 1K R889 1K R811 READY 1K R883 4.7K R8028 4.7K R8027 22R812 22R813 0.1uFC819 0.1uFC806 0.1uFC805 4.7K Non_Small_FHD R8010-*2 4.7K Small_FHD R8010-*1 4.7K Small_HD R896 4.7K Apollo R8010-*3 4.7K Small_FHD R896-*1 4.7K Non_Small_HD R8011-*1 4.7K Non_Small_HD R896-*2 4.7K Apollo R8011-*2 4.7K Apollo R898-*1 4.7K Non_Small_FHD R898 4.7K 100Hz R8011-*3 4.7K 100Hz R898-*2 4.7K R8011 Small_FHD 4.7K R8010 Small_HD 22R8005 22R8006 0 R 82 6 0 R 82 74 .7uF 10V C871 READY 120-ohm L800 1 2 0 -o h m L 8 0 1 120-ohm L802 2. 2u F C 82 3 2. 2u F C 82 4 2. 2u F C 82 1 2. 2u F C 87 3 2. 2u F C 82 2 2. 2u F C 87 4 2. 2u F C 80 2 2. 2u F C 87 5 MST99A88ML(MATRIX BASIC) IC800 1 RXBCKN 2 RXBCKP 3 RXB0N 4 RXB0P 5 HOTPLUGB 6 RXB1N 7 RXB1P 8 AVDD_33_1 9 RXB2N 10 RXB2P 11 RXACKN 12 RXACKP 13 RXA0N 14 RXA0P 15 AVDD_33_2 16 RXA1N 17 RXA1P 18 GND_1 19 RXA2N 20 RXA2P 21 HOTPLUGA 22 REXT 23 VCLAMP 24 REFP 25 REFM 26 BIN1P 27 SOGIN1 28 GIN1P 29 RIN1P 30 BINM 31 BIN0P 32 GINM 33 GIN0P 34 SOGIN0 35 RINM 36 RIN0P 37 AVDD_33_3 38 GND_2 39 BIN2P 40 GIN2P 41 SOGIN2 42 RIN2P 43 CVBS6 44 CVBS5 45 CVBS4 46 CVBS3 47 CVBS2 48 CVBS1 49 VCOM1 50 CVBS0 51 VCOM0 52 AVDD_33_4 53 CVBSOUT 54 GND_3 55 SIF0P 56 SIF0M 57 VDDC_1 58 AUL5 59 AUR5 60 AUVRM 61 AUOUTL2 62 AUOUTR2 63 AUOUTL1 64 AUOUTR1 65 AU L0 66 AU R0 67 AU L1 68 AU R1 69 AU L2 70 AU R2 71 AU L3 72 AU R3 73 AU CO M 74 AU L4 75 AU R4 76 GN D_ 4 77 AU VR P 78 AU VA G 79 AV DD _A U 80 GN D_ 5 81 VD DC _2 82 DD CA _C K 83 DD CA _D A 84 DD CD A_ CK 85 DD CD A_ DA 86 DD CD B_ CK 87 DD CD B_ DA 88 G PI O 20 89 VD DP _1 90 VD DC _3 91 UA RT 2_ RX 92 UA RT 2_ TX 93 DD CD C_ CK 94 RX CC KN 95 RX CC KP 96 DD CD C_ DA 97 RX C0 N 98 RX C0 P 99 GN D_ 6 10 0 RX C1 N 10 1 RX C1 P 10 2 AV DD _D M 10 3 RX C2 N 10 4 RX C2 P 10 5 HO TP LU GC 10 6 US B1 _D M 10 7 US B1 _D P 10 8 SC K 10 9 SD I 11 0 SD O 11 1 SC Z 11 2 PW M0 11 3 PW M1 11 4 PW M2 11 5 PW M3 11 6 LV A4 P 11 7 LV A4 M 11 8 LV A3 P 11 9 LV A3 M 12 0 LV AC KP 12 1 LV AC KM 12 2 LV A2 P 12 3 LV A2 M 12 4 LV A1 P 12 5 LV A1 M 12 6 LV A0 P 12 7 LV A0 M 12 8 VD DP _2 129LVB4P 130LVB4M 131LVB3P 132LVB3M 133LVBCKP 134LVBCKM 135LVB2P 136LVB2M 137LVB1P 138LVB1M 139LVB0P 140LVB0M 141AVDD_LPLL 142GND_7 143VDDC_4 144GPIO150/I2C_OUT_MUTE 145GPIO151/I2C_OUT_SD2 146GPIO152/I2C_OUT_SD3 147GND_8 148GPIO51 149GPIO52 150GPIO53 151GPIO54 152GPIO55 153GPIO56 154GPIO57 155GPIO58 156VDDP_3 157VDDC_5 158B_MDATA[4] 159B_MDATA[3] 160GND_9 161B_MDATA[1] 162B_MDATA[6] 163AVDD_DDR_1 164B_MDATA[11] 165B_MDATA[12] 166GND_10 167B_MDATA[9] 168B_MDATA[14] 169AVDD_DDR_2 170B_DDR2_DQM[1] 171B_DDR2_DQM[0] 172GND_11 173B_DDR2_DQS[0] 174B_DDR2_DQSB[0] 175AVDD_DDR_3 176VDDP_4 177GND_12 178B_DDR2_DQS[1] 179B_DDR2_DQSB[1] 180AVDD_DDR_4 181B_MDATA[15] 182B_MDATA[8] 183GND_13 184B_MDATA[10] 185B_MDATA[13] 186AVDD_DDR_5 187B_MDATA[7] 188B_MDATA[0] 189B_MDATA[2] 190B_MDATA[5] 191B_MCLK 192B_MCLKZ 19 3 GN D_ 14 19 4 AV DD _M EM PL L 19 5 MV RE F 19 6 A_ OD T 19 7 A_ RA SZ 19 8 A_ CA SZ 19 9 A_ M AD R[ 0] 20 0 A_ M AD R[ 2] 20 1 A_ M AD R[ 4] 20 2 GN D_ 15 20 3 A_ M AD R[ 6] 20 4 A_ M AD R[ 8] 20 5 A_ M AD R[ 11 ] 20 6 A_ W EZ 20 7 A_ BA DR [1 ] 20 8 A_ BA DR [0 ] 20 9 A_ M AD R[ 1] 21 0 A_ M AD R[ 10 ] 21 1 AV DD _D DR _6 21 2 A_ M AD R[ 5] 21 3 A_ M AD R[ 9] 21 4 A_ M AD R[ 12 ] 21 5 A_ M AD R[ 7] 21 6 A_ M AD R[ 3] 21 7 A_ MC LK E 21 8 VD DC _6 21 9 I2 S_ IN _W S/ G PI O 67 22 0 I2 S_ IN _B C K/ G PI O 68 22 1 I2 S_ IN _S D 22 2 I2S _O UT _M CK 22 3 I2 S_ O UT _W S 22 4 VD DP _5 22 5 GN D_ 16 22 6 VD DC _7 22 7 I2 S_ O UT _B CK 22 8 I2 S_ O UT _S D 22 9 SP DI FO 23 0 UA RT 2_ RX /I2 CM _S DA 23 1 UA RT 2_ TX /I2 CM _S CK 23 2 UA RT 1_ RX /G PI O 86 23 3 UA RT 1_ TX /G PI O 87 23 4 GN D_ 17 23 5 GN D_ 18 23 6 US B0 _D M 23 7 US B0 _D P 23 8 SA R0 23 9 SA R1 24 0 SA R2 24 1 SA R3 24 2 AV DD _M PL L 24 3 XO UT 24 4 XI N 24 5 G PI O 13 4 24 6 G PI O 13 5 24 7 G PI O 13 8 24 8 G PI O 13 9 24 9 G PI O 14 0 25 0 IR IN 25 1 HS YN C0 25 2 VS YN C0 25 3 HS YN C1 25 4 VS YN C1 25 5 CE C 25 6 HW RE SE T LGE3767A [MST99A88ML(MATRIX ONLY SD DIVX_ NON RM) ] IC800-*1 1RXBCKN 2RXBCKP 3RXB0N 4RXB0P 5HOTPLUGB 6RXB1N 7RXB1P 8AVDD_33_1 9RXB2N 10RXB2P 11RXACKN 12RXACKP 13RXA0N 14RXA0P 15AVDD_33_2 16RXA1N 17RXA1P 18GND_1 19RXA2N 20RXA2P 21HOTPLUGA 22REXT 23VCLAMP 24REFP 25REFM 26BIN1P 27SOGIN1 28GIN1P 29RIN1P 30BINM 31BIN0P 32GINM 33GIN0P 34SOGIN0 35RINM 36RIN0P 37AVDD_33_3 38GND_2 39BIN2P 40GIN2P 41SOGIN2 42RIN2P 43CVBS6 44CVBS5 45CVBS4 46CVBS3 47CVBS2 48CVBS1 49VCOM1 50CVBS0 51VCOM0 52AVDD_33_4 53CVBSOUT 54GND_3 55SIF0P 56SIF0M 57VDDC_1 58AUL5 59AUR5 60AUVRM 61AUOUTL2 62AUOUTR2 63AUOUTL1 64AUOUTR1 6 5 A U L 0 6 6 A U R 0 6 7 A U L 1 6 8 A U R 1 6 9 A U L 2 7 0 A U R 2 71 A U L 3 7 2 A U R 3 7 3 A U C O M 7 4 A U L 4 7 5 A U R 4 7 6 G N D _ 4 7 7 A U V R P 7 8 A U V A G 7 9 A V D D _A U 8 0 G N D _ 5 8 1 V D D C _ 2 8 2 D D C A _C K 8 3 D D C A _D A 8 4 D D C D A _C K 8 5 D D C D A _D A 8 6 D D C D B _C K 8 7 D D C D B _D A 8 8 G P IO 2 0 8 9 V D D P _ 1 9 0 V D D C _ 3 9 1 U A R T 2 _ R X 9 2 U A R T 2 _ T X 9 3 D D C D C _C K 9 4 R X C C K N 9 5 R X C C K P 9 6 D D C D C _D A 9 7 R X C 0N 9 8 R X C 0 P 9 9 G N D _ 6 1 0 0 R X C 1N 1 0 1 R X C 1 P 1 0 2 A V D D _D M 1 0 3 R X C 2N 1 0 4 R X C 2 P 1 0 5 H O T P LU G C 1 0 6 U S B 1_ D M 1 0 7 U S B 1 _ D P 1 0 8 S C K 1 0 9 S D I 1 1 0 S D O 1 1 1 S C Z 1 1 2 P W M 0 1 1 3 P W M 1 1 1 4 P W M 2 1 1 5 P W M 3 1 1 6 L V A 4 P 1 1 7 LV A 4M 1 1 8 L V A 3 P 1 1 9 LV A 3M 1 2 0 LV A C K P 1 2 1 LV A C K M 1 2 2 L V A 2 P 1 2 3 LV A 2M 1 2 4 L V A 1 P 1 2 5 LV A 1M 1 2 6 L V A 0 P 1 2 7 LV A 0M 1 2 8 V D D P _ 2 129 LVB4P 130 LVB4M 131 LVB3P 132 LVB3M 133 LVBCKP 134 LVBCKM 135 LVB2P 136 LVB2M 137 LVB1P 138 LVB1M 139 LVB0P 140 LVB0M 141 AVDD_LPLL 142 GND_7 143 VDDC_4 144 GPIO150/I2C_OUT_MUTE 145 GPIO151/I2C_OUT_SD2 146 GPIO152/I2C_OUT_SD3 147 GND_8 148 GPIO51 149 GPIO52 150 GPIO53 151 GPIO54 152 GPIO55 153 GPIO56 154 GPIO57 155 GPIO58 156 VDDP_3 157 VDDC_5 158 B_MDATA[4] 159 B_MDATA[3] 160 GND_9 161 B_MDATA[1] 162 B_MDATA[6] 163 AVDD_DDR_1 164 B_MDATA[11] 165 B_MDATA[12] 166 GND_10 167 B_MDATA[9] 168 B_MDATA[14] 169 AVDD_DDR_2 170 B_DDR2_DQM[1] 171 B_DDR2_DQM[0] 172 GND_11 173 B_DDR2_DQS[0] 174 B_DDR2_DQSB[0] 175 AVDD_DDR_3 176 VDDP_4 177 GND_12 178 B_DDR2_DQS[1] 179 B_DDR2_DQSB[1] 180 AVDD_DDR_4 181 B_MDATA[15] 182 B_MDATA[8] 183 GND_13 184 B_MDATA[10] 185 B_MDATA[13] 186 AVDD_DDR_5 187 B_MDATA[7] 188 B_MDATA[0] 189 B_MDATA[2] 190 B_MDATA[5] 191 B_MCLK 192 B_MCLKZ1 9 3 G N D _ 1 4 1 9 4 A V D D _M E M P LL 1 9 5 M V R E F 1 9 6 A _O D T 1 9 7 A _ R A S Z 1 9 8 A _ C A S Z 1 9 9 A _ M A D R [0 ] 2 0 0 A _ M A D R [2 ] 2 0 1 A _ M A D R [4 ] 2 0 2 G N D _ 1 5 2 0 3 A _ M A D R [6 ] 2 0 4 A _ M A D R [8 ] 2 0 5 A _ M A D R [1 1 ] 2 0 6 A _W E Z 2 0 7 A _ B A D R [1 ] 2 0 8 A _ B A D R [0 ] 2 0 9 A _ M A D R [1 ] 2 1 0 A _ M A D R [1 0 ] 2 1 1 A V D D _D D R _6 2 1 2 A _ M A D R [5 ] 2 1 3 A _ M A D R [9 ] 2 1 4 A _ M A D R [1 2 ] 2 1 5 A _ M A D R [7 ] 2 1 6 A _ M A D R [3 ] 2 1 7 A _M C LK E 2 1 8 V D D C _ 6 2 1 9 I2 S _ IN _ W S /G P IO 6 7 2 2 0 I2 S _ IN _ B C K /G P IO 6 8 2 2 1 I2 S _ IN _ S D 2 2 2 I2 S _ O U T _ M C K 2 2 3 I2 S _ O U T _ W S 2 2 4 V D D P _ 5 2 2 5 G N D _ 1 6 2 2 6 V D D C _ 7 2 2 7 I2 S _ O U T _ B C K 2 2 8 I2 S _ O U T _ S D 2 2 9 S P D IF O 2 3 0 U A R T 2 _ R X /I2 C M _ S D A 2 3 1 U A R T 2 _ T X /I 2 C M _ S C K 2 3 2 U A R T 1 _ R X /G P IO 8 6 2 3 3 U A R T 1 _ T X /G P IO 8 7 2 3 4 G N D _ 1 7 2 3 5 G N D _ 1 8 2 3 6 U S B 0_ D M 2 3 7 U S B 0 _ D P 2 3 8 S A R 0 2 3 9 S A R 1 2 4 0 S A R 2 2 4 1 S A R 3 2 4 2 A V D D _M P LL 2 4 3 X O U T 2 4 4 X IN 2 4 5 G P IO 1 3 4 2 4 6 G P IO 1 3 5 2 4 7 G P IO 1 3 8 2 4 8 G P IO 1 3 9 2 4 9 G P IO 1 4 0 2 5 0 IR IN 2 5 1 H S Y N C 0 2 5 2 V S Y N C 0 2 5 3 H S Y N C 1 2 5 4 V S Y N C 1 2 5 5 C E C 2 5 6 H W R E S E T 3.3KR819 DS UB _S DA LE D_ R RT1C3904-T112 Q805 READY E BC DDC_WP 10K R828 READY 4.7K R878 4.7KR893 1KR861 0 R8037 NON 19_22" 0 R 89 4 0 R 89 9 2K R886 150R885 1KR860 10K R8000 33KR8007 NON 19_22" 10K R855 1K R853 100R888 33K R887 20K R8036 19_22_26" 20 pF C 81 7 2 0p F C 81 6 DD R2 _A [2 ] DDR2_D[1] DD R2 _A [6 ] G N D DDR2_D[5] DD R2 _A [1 0] DDR2_D[0] DDR2_D[10] DD R2 _A [1 2] DDR2_D[14] DD R2 _A [0 ] DDR2_D[6] DD R2 _A [5 ] DDR2_D[3] DD R2 _A [4 ] DDR2_D[4] DDR2_D[12] DD R2 _A [9 ] DDR2_D[11] DD R2 _A [8 ] DDR2_D[8] DDR2_D[7] DDR2_D[15] DDR2_D[9] DD R2 _A [3 ] DDR2_D[13] DD R2 _A [1 1] DDR2_D[2] DD R2 _A [1 ] DD R2 _A [7 ] TXCE4- TXCE4+ TXCE3- TXCE3+ TXCLKE- TXCLKE+ TXCE2- TXCE2+ TXCE1- TXCE1+ TXCE0- TXCE0+ TXCO4- TXCO4+ TXCO3- TXCO3+ TXCLKO- TXCLKO+ TXCO2- TXCO2+ TXCO1- TXCO1+ TXCO0- TXCO0+ I2S_OUT HDMI_3 EEPROM HD M I_1 [MODE SELECTION] HD M I_2 C804/C805/C806:Close to IC a s c l o s e a s p o s s i b l e GAIN X 4 RESET C lo se t o IC w it h w id th t ra ce C l o s e t o I C a s c l o s e a s p o s s i b l e HDCP EEPROM US B PA RT SERIAL FLASH 64M S-VIDEO 4.7K X 4.7K 4.7K X4.7K R8010 X R898 Non Small FHD 4.7K X 4.7K Small HD *H/W OPTION 4.7K 4.7K 4.7K 100HZ 4.7K 4.7K4.7K Apollo Non Small HD R8011 X X X 4.7K X R896 X Small FHD (27) 4.7K X ** Sma l l HD : 19 /22 /26 Inch ** Non Small FHD : Normal(non 100Hz) FHD Model THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. SC H EM ATIC D IA G R A M C opyright LG E lectronics. Inc. A ll right reserved. O nly for training and service purposes LG E Internal U se O nly M S TA R +1.8V_DDR DDR2_A[0-12] DDR2_BA0 DDR2_BA1 DDR2_MCLK DDR2_MCLKZ DDR2_CKE DDR2_ODT DDR2_RASZ DDR2_CASZ DDR2_WEZ DDR2_DQS0P DDR2_DQS1P DDR2_DQM0 DDR2_DQM1 DDR2_DQS0M DDR2_DQS1M +1.8V_DDR +1.8V_DDR DDR2_D[0-15] 1000pF C905 V_REF 56 R900 56 R901 56 R902 56 R903 56 R904 56 R905 0.01uF C904 0.01uF 50V C900 0.01uF C901 0.01uF C902 0.01uF C903 0.01uF C906 0.01uF C907 0.01uF C908 0.01uF C909 0.01uF C910 0.01uF C911 0.01uF C912 0.01uF C913 0.01uF C914 0.01uF C915 0.01uF C916 0.01uF C917 +1.8V_DDR 150 R906 READY THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. V_REF 0.1uF 50V C918 HYB18TC512160B2F-2.5 IC900 J2VREF J8CK H2 VSSQ2 B7UDQS N8A4 P8A8 L1NC4 L2BA0 R8NC3 K7RAS F8 VSSQ3 F3LDM P3A9 M3A1 N3A5 K8CK R3NC5 L3BA1 J7VSSDL L7CAS F2 VSSQ4 B3UDM M2A10/AP K2CKE R7NC6 M7A2 N7A6 M8A0 J1VDDL K3WE E8LDQS P7A11 K9ODT A2NC1 N2A3 P2A7 H8 VSSQ1 F7LDQS A8UDQS R2A12 L8CS E2NC2 E7 VSSQ5 D8 VSSQ6 D2 VSSQ7 A7 VSSQ8 B8 VSSQ9 B2 VSSQ10 P9 VSS1 N1 VSS2 J3 VSS3 E3 VSS4 A3 VSS5 G9 VDDQ1 G7 VDDQ2 G3 VDDQ3 G1 VDDQ4 E9 VDDQ5 C9 VDDQ6 C7 VDDQ7 C3 VDDQ8 C1 VDDQ9 A9 VDDQ10 R1 VDD1 M9 VDD2 J9 VDD3 E1 VDD4 A1 VDD5 B9 DQ15 B1 DQ14 D9 DQ13 D1 DQ12 D3 DQ11 D7 DQ10 C2 DQ9 C8 DQ8 F9 DQ7 F1 DQ6 H9 DQ5 H1 DQ4 H3 DQ3 H7 DQ2 G2 DQ1 G8 DQ0 10uF 10V C919 1 K R 9 0 7 1 K R 9 0 8 DDR2_A[0] DDR2_A[12] DDR2_A[11] DDR2_A[1] DDR2_A[2] DDR2_A[3] DDR2_A[4] DDR2_A[5] DDR2_A[6] DDR2_A[7] DDR2_A[8] DDR2_A[9] DDR2_A[10] DDR2_D[0-15] DDR2_D[0] DDR2_D[1] DDR2_D[2] DDR2_D[3] DDR2_D[4] DDR2_D[5] DDR2_D[6] DDR2_D[7] DDR2_D[8] DDR2_D[9] DDR2_D[10] DDR2_D[11] DDR2_D[12] DDR2_D[13] DDR2_D[14] DDR2_D[15] DDR2 MEMORY Close to DDR2 IC Close to DDR2 IC C opyright LG E lectronics. Inc. A ll right reserved. O nly for training and service purposes LG E Internal U se O nly D D R 2 47uF 25V C1002 10KR1003 NON 19_22" 0.01uF C1007 DISP_EN/VAVS_ON 0.01uF C1046 RL_ON SAM2333 D1002 0.01uF C1008 2SC3875S Q1000 NON 19_22" 1 2 3 0.01uF C1011 0.01uF C1021 2SC3875S Q10021 2 3 100R1044-*1 PWM_DIM 10KR1047 E-DIMI-DIM 4.7KR1054 NON SHARP 32&52",AUO PANEL_STATUS 33K R1065 NON 19_22" 1uF25V C1056 33K R1049 10KR1048 RT1C3904-T112 Q1001 E B C 0.01uF C1010 0.1uF C1005 100uF16V C1009 POWER_SW 10K R1002 SI4925BDY EBK32753101 Q1003 3S2 2G1 4G2 1S1 5 D2_1 6 D2_2 7 D1_1 8 D1_2 RT1C3904-T112 Q1004 E B C 10K R1068 1.6K R1069 22K R1070 1uF C1048 0.01uF C1053 0 CMO 32,42,47,57 R1045 0 CMO 32,42,47 R1039 0 CMO 57" R1040 0 NON CMO 32,42,47,57 R1043 0 CMO 57" R1041 0R1064 0 NON (CMO 32,42,47,57, SHARP 32") R1023 0 SHARP 52",AUO R1053 0 NON CMO 57" R1001 0 CMO 32,42,47,57 R1014 0 R1042 1.2K R1005 P_12V_SMALL_15V P_5V P_5V P_12V_SMALL_15V +16V_NTP +12V_AUDIO +5VST_MST P_12V_SMALL_15V +5VST_MST +3.3V_MST +5V_USB +5V_TUNER +5V_+12V_LCD +5V_MULTI P_5V +5V_MULTI P_5V P_12V_SMALL_15V P_5V +5VST_MST +5V_MULTI PANEL_ON 0.1uF 50V C1001 10uF16V C1052 10uF 16V C1019 10uF 16V C1003 1 /4 W 0 5%R 1 0 7 4 1 9 _ 2 2 " SMAW200-11 P1002 19_22" 1 15V 2 15V 3 GND 4 GND 5 5V 6 5V 7 NC 8 NC 9 Inverter_ON 10 PWM_Dim 11 A.Dim P_5V P_24V_SMALL_15V P_12V_SMALL_15V P_24V_SMALL_15V P_24V_SMALL_15V OPC_OUT 0 READY R1077 10K19_22" R1065-*1 MP2212DN IC1006 3IN 2GND 4BS 1FB 5 VCC 6 SW_1 7 SW_2 8 EN/SYNC +5V_MULTI 10 R1056READY 0.1uF 50V C1024 READY 10K R1059 NON 19_22" 100uF 16V C1026 5.6K R1058 30K R1057 S2A 50V 19_22" D1001 10uF 25V C1030 10uF 25V C1031 10uF 16V C1000 10uF 16V C1020 +1.2V_VDDC_MST 0R1073 0.1uF C1054 +3.3V_MULTI_MST 100uF16V C1028 +1.8V_DDR +1.8V +5V_MULTI AP2121N-3.3TRE1 IC1007 1 GND 2 VOUT3VIN 0.1uF 16V C1014 BD9130EFJ-E2 IC1001 3 ITH 2 VCC 4 GND 1 ADJ 5 PGND 6 SW 7 PVCC 8 EN 10K R1006 1 /1 0 W 2 K 1%R 1 0 0 9 1 /1 0 W 3.3K 1% R1010 10uF 10V C1016 10uF 6.3V C1022 0.1uF 50V C1015 0.1uF 50V C1023 12K R1008 560pF 50V C1012 2200pF 50V C1055 READY 3 . 3 R1078 READY 10uF 16V C1004 10uF 16V C1013 10K R1079 AZ1085S-3.3TR/E1 IC1003 1 ADJ/GND 2 OUTPUT3INPUT 10uF 16V C1017 10uF 16V C1018 AP1117EG-13 IC1002 1 ADJ/GND 2 OUT3IN 1KR1044 DC_DIM 1K R1076 OPC_DISABLE 1K R1075 OPC_ENABLE 0 R1013 2.2K R1050 2.2K R1051 2.2K R1052 68uF 35V C1006 0 R1012 NON 19_22" 3.6uHL1009 CIC21J501NE EAM58113401 L1000 CIC21J501NE L1008 FW20020-24S P1000 NON_19_22_26" 19NC 14 12V 95.2V 4 GND 18 24V 1312V 8 5.2V 3GND 1724V 12 GND 75.2V 2 Power ON 16 GND 11GND 6 GND 1NC 20 Inver te r ON 15GND 10 5.2V 5GND 21A.Dim 22 Er ro r Ou t 23NC 24 PWM Dim 120 5% R1004 56 1% R1007 10KR1017 19_22" 2SC3875S Q1005 19_22" 1 2 3 RL_ON +5V_MULTI 10R1015 19_22" 4.7K R1016 19_22" 120-ohm L1001 120-ohm 19/22"(HD)/22"(FHD)/32"(Sharp) L1005 120-ohm 26/27/32(LPL) /37 /42 /47 /52" L1006 0LCML00003B MLB-201209-0120P-N2 L1007 MLB-201209-0120P-N2 L1010 MLB-201209-0120P-N2 120-ohm L1012 MLB-201209-0120P-N2 120-ohm L1013 1uF 25V C1035 0.1uF 16V C1025 0.47uF 25V C1043 NON SHARP 52",AUO 2.2uF 16V C1045 DC_DIM 2.2uF 16V C1044 3K R1046 FM20020-24 P1001 26" 19NC 14 12V 95.2V 4 GND 18 24V 1312V 8 5.2V 3GND 1724V 12 GND 75.2V 2 Power ON 16 GND 11GND 6 GND 1NC 20 Inver te r ON 15GND 10 5.2V 5GND 21A.Dim 22 Er ro r Ou t 23NC 24 PWM Dim 25 . 2.2uH L1002 10K R1020 2K R1018 NON 19_22" 1K OPC_DISABLE R1021 1K OPC_ENABLE R1022 68uF 35V C1027 READY 10 R1024 0.1uF 50V C1029 +5V_MULTI 0 R1011 560pF 50V C1032 2.2K R1000 NON 19_22" 1uF 25V READY C1034 1uF 25V READY C1036 1uF 25V READY C1037 1uF 25V READY C1038 0.1uF 50V C1033 LED Block **5V_MULTI->3.3V->1.2V **Switch 12V:P12V **Switch 5V:5V_MULTI -> 1.8V *SHARP32":DC DIMMING **DC-DC CONVERTER 12V->5V_TUNER/USB OUT:5V *ST 5V->3.3V **OPC_ENABLE : USE LGD Module MAX 300mA MAX 3A OUT:1.27V NTP,AUDIO DSP DDR2, Vref V0 = 0 .8* (1+(R2/R1) ) MAX 2A MAX 3A R1 R2 MAX 1A OUT:3.3V R1 R2 V0 = 0 .8* (1+(R1/R2) ) V0 = 1 .25*(1+(R2/R1)) R1 R2 OUT:1.85V Smal l (19_22") Close to Q1003 THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. C opyright LG E lectronics. Inc. A ll right reserved. O nly for training and service purposes LG E Internal U se O nly P O W E R 0.1uF C644 0.1uF C637 M _S DA 1000pF C606 22000pF C616 22000pFC623+1.8V_DVDD 1000pF 50V C651 0.47uF C632 MULTI_PW_SW 0.1uF C605 +1.8V_DVDD 0.1uF C615 0.1uF C629 AM P_ M UT E_ HO TE L +3.3V_MULTI_MST 0.1uF C643 DA-8580 EAP38319001 L607 2S 1S 1F 2F 0.1uF C617 0.1uF C602 0.01uF C647 SPK_R+ M _S CL 0 .1uF C610 DA-8580 EAP38319001 L603 2S 1S 1F 2F 22000pFC611 SPK_L+ +1.8V_AVDD SPK_L- 0.1uF C669 +16V_NTP +16V_NTP SPK_R- 100pF C601 22000pF C625 +1.8V_AVDD 0.01uF C672 0.01uF C648 1000pF C603 SW_RESET 0.47uF C673 0.01uF C671 0.1uF C626 0.01uF C613 330uF35V C612 SPK_L- SPK_R+ +1.8V_DVDD SPK_R- SMAW250-04 P600 1 2 3 4SPK_L+ +1.8V_AVDD +1.8V I2S_MCLK I2 S_ SD O I2 S_ W S I2 S_ SC K 390pF C619 390pF C621 390pF C630 390pF C634 1uF C608 1uF C618 1uF C624 1uF C614 0.1uF 50V C607 10uF 35V C642READY +12V_AUDIO MNT_R_AMP +12V_AUDIO RT1C3904-T112 Q600 E B C RT1C3904-T112 Q601 E B C MNT_L_AMP 0.01uF C635 MNT_ROUT +12V_AUDIO LM324D IC601 3 INPUT1+ 2 INPUT1- 4 VCC 1 OUT1 6 INPUT2- 5 INPUT2+ 7 OUT2 8OUT3 9INPUT3- 10INPUT3+ 11GND 12INPUT4+ 13INPUT4- 14OUT4 6800pF C628 6800pF C627 MNT_LOUT AUDIO_R SPK_R-_HOTEL SPK_R+_HOTEL 12505WR-09A00 HOTEL_OPT P601 1 2 3 4 5 6 7 8 9 10 0.1uF HOTEL_OPT C636 +16V_NTP RT1C3904-T112 HOTEL_OPT Q602 E B C AMP_MUTE_HOTEL +3.3V_MULTI_MST SW_RESET 10uF 16V C600 10uF 16V C604 10uF16V C609 3 . 3 R604 12 R608 12 R611 12 R610 12 R638 4.7K R663 4.7K R623 3 . 3 R626 3 . 3 R625 100R601 3.3K R600 1 0 0 R 6 7 6 1 0 0 R 6 7 7 1 0 0 R 6 7 8 100 R602 100 R603 0 R 65 6 HO TE L_ OP T 0R673 12 R658 12 R653 12 R621 12 R654 4.7K R628 4.7K R667 3 . 3 R671 3 . 3 R635 1K R607 10K NON_HOTEL_OPT R613 12K HOTEL_OPT R613-* 5.6KR614 5.6KR615 10K NON_HOTEL_OPT R616 12K HOTEL_OPT R616-* 1K R609 4.7K R606 200 HOTEL_OPT R612 10K HOTEL_OPT R617 0 HOTEL_OPT R620 0 HOTEL_OPT R619 4.7K R605 33pFC631 33pFC633 0.1uF C620 0.1uF C622 6.8K R618 6.8K R622 NTP-3100L IC600 1BST1A 2VDR1A 3RESET 4AD 5DVSS_1 6VSS_IO 7CLK_I 8VDD_IO 9DGND_PLL 10AGND_PLL 11LFM 12AVDD_PLL 13DVDD_PLL 14TEST0 15 DV SS _2 16 DV DD 17 SD AT A 18 W CK 19 BC K 20 SD A 21 SC L 22 M ON IT OR _0 23 M ON IT OR _1 24 M ON IT OR _2 25 FA UL T 26 VD R2 B 27 BS T2 B 28 PG ND 2B _1 29 PGND2B_2 30 OUT2B_1 31 OUT2B_2 32 PVDD2B_1 33 PVDD2B_2 34 PVDD2A_1 35 PVDD2A_2 36 OUT2A_1 37 OUT2A_2 38 PGND2A_1 39 PGND2A_2 40 BST2A 41 VDR2A 42 NC 43 VD R1 B 44 BS T1 B 45 PG ND 1B _1 46 PG ND 1B _2 47 O UT 1B _1 48 O UT 1B _2 49 PV DD 1B _1 50 PV DD 1B _2 51 PV DD 1A _1 52 PV DD 1A _2 53 O UT 1A _1 54 O UT 1A _2 55 PG ND 1A _1 56 PG ND 1A _2 MLB-201209-0120P-N2 0LCML00003B 120-ohm L605 MLB-201209-0120P-N2 0LCML00003B 120-ohm L606 33pF 50V C638 READY 33pF 50V C639 READY +3.3V_MST 10K R630 RT1C3904-T112 Q603 E B C 10KR629 MULTI_PW_SW 0 R627 READY 0 R624 READY 22K R631READY SPK_L- Main AMP AMP :GAIN X 4 Chinese Hote l Opt ion THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. C opyright LG E lectronics. Inc. A ll right reserved. O nly for training and service purposes LG E Internal Use O nly A U D I MAIN_SIF 0.01uF C501 M_SDA 27pF C500 +5V_TUNER TV_MAIN M_SCL +5V_TUNER C504 READY 27pF C502 10uH L502 READY 82pF C507 READY 10uF 16V C508 120-ohm L500 READY ISA1530AC1 Q502 E B C TAFT-H203F TU500-*1 NTSC_TUNER 14 NC_5 13 V-OUT 5 RF_AGC 12 NC_4 11 MOPLL_AS 2 GND_1 19 NC_8 18 NC_7 10 SCL 4 NC_2 1 NC_1 17 NC_6 9 SDA 8 GND_2 3 +B[5V] 16 SIF-OUT 7 NC_3 6 TP[3.3V_OPT] 15 A-OUT 21 SHIELD 20 NC_9 TAFT-Z203D TU500 PAL_TUNER 14 NC_5 13 V-OUT 5 RF_AGC 12 NC_4 11 MOPLL_AS 2 GND_1 19 NC_8 18 NC_7 10 SCL 4 NC_2 1 NC_1 17 NC_6 9 SDA 8 GND_2 3 +B[5V] 16 SIF-OUT 7 NC_3 6 TP[3.3V_OPT] 15 A-OUT 21 SHIELD 20 NC_9 4.7K R502 220 R506 220 R507 100uF16V C505 100uF16V C509 100uF16V C506 120-ohm L501 47R504 47R505 0.1uF 50V C503 0 L501-*1 0 Ohm Near the p in THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. C opyright LG E lectronics. Inc. A ll right reserved. O nly for training and service purposes LG E Internal U se O nly T U N E R TMDS3_RX2- +5V_HDMI_2 TMDS3_RXC- HPD_MST_2 TMDS3_RX0+ TMDS2_RX2- CEC TMDS2_RXC- TMDS2_RXC+ TMDS1_RXC- TMDS2_RX0+ TMDS3_RX0- TMDS3_RX1+ TMDS3_RXC+ +5V_HDMI_2 HPD_MST_1 CEC TMDS1_RX2+ TMDS2_RX1+ +5V_MULTI +5V_HDMI_1 TMDS3_RX2+ TMDS2_RX0- TMDS1_RX1- TMDS2_RX1- TMDS1_RX2- +5V_HDMI_3 TMDS3_RX1- +5V_MULTI +5V_HDMI_3 +5V_MULTI +5V_HDMI_1 TMDS1_RX0- TMDS1_RX1+ CEC TMDS1_RX0+ TMDS2_RX2+ TMDS1_RXC+ HPD_MST_3 DDC_SDA2 DDC_SCL2 DDC_SDA1 DDC_SCL1 DDC_SDA3 DDC_SCL3 JP304 JP305 JP301 JP300 JP302 JP303 2SC3875S RT1C3904-T112 Q301 E B C 2SC3875S RT1C3904-T112 Q300 E B C 2SC3875S RT1C3904-T112 Q302 E B C KJA-ET-0-0032 JK303 14 NC 13 CEC 5 DATA1_SHIELD 20 JACK_GND 12 CLK- 11 CLK_SHIELD 2 DATA2_SHIELD 19 HPD 18+5V_POWER 10 CLK+ 4 DATA1+ 1 DATA2+ 17DDC/CEC_GND 9 DATA0- 8 DATA0_SHIELD 3 DATA2- 16 SDA 7 DATA0+ 6 DATA1- 15 SCL KDS184S D300A 1 C A 2 KDS184S D301A 1 C A 2 KDS184S D302A 1 C A 2 CAT24C02WI-GT3 IC301 3 A2 2 A1 4 VSS 1 A0 5 SDA 6 SCL 7 WP 8 VCC CAT24C02WI-GT3 IC302 3 A2 2 A1 4 VSS 1 A0 5 SDA 6 SCL 7 WP 8 VCC CAT24C02WI-GT3 IC300 3 A2 2 A1 4 VSS 1 A0 5 SDA 6 SCL 7 WP 8 VCC DDC_WP DDC_WP DDC_WP BSS83CEC_READY Q303 S B D G CEC +3.3V_MST CEC_C CDS3C30GTH 30V CEC_READY D304 MMBD301LT1G 30V CEC_READY D303 10K R301 1K R303 0.01uF C300 10K R300 1K R302 100R329 1K R314 10K R312 68K CEC_READY R315 0 R313 100R317 100R318100R305 100R304 0.01uF C301 100R331 100R306 100R307 0.01uF C302 100R327 10K R308 10K R310 10K R309 10K R311 10K R319 10K R320 QJ41193-CFEE1-7F JK301 1 DATA2+ 2 DATA2_SHIELD 3 DATA2- 4 DATA1+ 5 DATA1_SHIELD 6 DATA1- 7 DATA0+ 8 DATA0_SHIELD 9 DATA0- 10 CLK+ 11 12 13 14 15 16 17 18 19 20JACK_GND 21 . 22 QJ41193-CFEE1-7F JK302 1 DATA2+ 2 DATA2_SHIELD 3 DATA2- 4 DATA1+ 5 DATA1_SHIELD 6 DATA1- 7 DATA0+ 8 DATA0_SHIELD 9 DATA0- 10 CLK+ 11 12 13 14 15 16 17 18 19 20JACK_GND 21 . 22 56K CEC_READY R316 OPTION SW_HPD : USE SW HPD (Default) MST_HPD : USE MST HPD THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. C opyright LG E lectronics. Inc. A ll right reserved. O nly for training and service purposes LG E Internal U se O nly H D M I THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. CVBS_LIN MUTE_LINE AUDIO_R SD05 ZD100 100uF16V C102 SD05 ZD103 SD05 ZD105 MNT_ROUT CVBS_VIN SPK_R+_HOTEL RT1C3904-T112 Q100 EB C SPK_R-_HOTEL CVBS_RIN SD05 ZD104 10uF16V C101 MUTE_LINE SD05 ZD101 SD05 ZD102 MNT_LOUT RT1C3904-T112 Q101 E B C MNT_VOUT 10uF16V C100 30V NON_HOTEL_OPT D102 30V NON_HOTEL_OPT D103 30V D101 30VADUC30S03010L_AMODIODE D100 30V D104 30V D105 COMP2_Y COMP2_PB COMP2_PR COMP2_L COMP2_R S_VIDEO_DET SIDE_Y SIDE_C +3.3V_MULTI_MST OPT READY C104 30V D106 30V D107 SD05 ZD106 SD05 ZD107 PSJ014-01 JK101 S-VIDEO GND 6 1 C-LUG1 2 C-LUG2 3 0-SPRING 4 C-LUG3 5 C-LUG4 SHIELD7 75R102 0 HOTEL_OPT R103 0 HOTEL_OPT R105 0 NON_HOTEL_OPT R106 0 HOTEL_OPT R101 75 R109 75 R108 75 R107 220K R104 12K R118 12K R117 12K R119 12K R120 10KR113 10KR115 10KR116 220K R100 220K R111 220K R112 75 R110 75 R122 S-VIDEO 75 R121 S-VIDEO 10K R123 100pF READY C103 10KR114 PPJ226-01 JK100 9A [GN]1P_CAN 4A [GN]O-SPRING_A 3A [GN]CONTACT_A 9B [BL]1P_CAN 8B [BL]C-LUG_A 9C [RD]1P_CAN_1 8C [RD]C-LUG_A 9D [WH]1P_CAN 8D [WH]C-LUG_A_1 9E[RD]1P_CAN_2 4E[RD]O-SPRING_A_1 3E [RD]CONTACT_A_1 9F [YL]2P_CAN 4F [YL]O-SPRING_A 3F [YL]CONTACT_A 9G [WH]2P_CAN 8G [WH]C-LUG_A_2 9H [RD]2P_CAN 4H [RD]O-SPRING_A_2 3H [RD]CONTACT_A_2 5J[YL]O-SPRING_B 6J[YL]CONTACT_B 7K[WH]C-LUG_B 5L[RD]O-SPRING_B 6L[RD]CONTACT_B POP NOISE M NT _O UT CO M PO NENT1 POP NOISE AV1 COMPONENT1, AV1, MNT_OUT[JACK PACK TYPE D] : JK100 S-VIDEO(China Model) C opyright LG E lectronics. Inc. A ll right reserved. O nly for training and service purposes LG E Internal U se O nly IN P U T 1 USB_DN USB_DP SIDE_LIN SIDE_RIN 5.6B ZD203 SIDE_V PPJ218-01 JK201 5C[RD]CONTACT 2C[RD]U_CAN 4C[RD]O_SPRING 2B[WH]U_CAN 3B[WH]C_LUG 2A[YL]U_CAN 5A[YL]CONTACT 4A[YL]O_SPRING 5.6B ZD202 U S B D O W N S T R E A M KJ A- U B- 4- 00 04 SIDE_USB JK204 1 2 3 4 5 IR_OUT +3.3V_MST TXD 4.7K R204 ST3232CDR IC200 3C1- 2V+ 4C2+ 1C1+ 6V- 5C2- 7T2OUT 8R2IN 9 R2OUT 10 T2IN 11 T1IN 12 R1OUT 13 R1IN 14 T1OUT 15 GND 16 VCC 4.7K R205 RXD KCN-DS-1-0088 JK200 1 2 3 4 5 6 7 8 9 10 +3.3V_MST +5VST_MST 6630TGA004K KCN-DS-1-0089 JK202 1 RED 2 GREEN 3 BLUE 4 GND_1 5 DDC_GND 6 RED_GND 7 GREEN_GND 8 BLUE_GND 9 NC 10 SYNC_GND 11 GND_2 12 DDC_DATA 13 H_SYNC 14 V_SYNC 15 DDC_CLOCK 16 SHILED SD05 ZD200 DSUB_SDA PC_VS SD05 ZD201 E N K M C 2 8 3 7 -T 1 1 2 D 2 1 1A A C C PC_B E N K M C 2 8 3 7 -T 1 1 2 D 2 1 0A A C C PEJ024-01 JK203 6B T_TERMINAL2 8 SHIELD_PLATE 7B B_TERMINAL2 5 T_SPRING 4 R_SPRING 7A B_TERMINAL1 6A T_TERMINAL1 3 E_SPRING DSUB_SDA PC_AUD_R PC_G DSUB_SCL CAT24C02WI-GT3 IC201 3 A2 2 A1 4 VSS 1 A0 5 SDA 6 SCL 7 WP 8 VCC E N K M C 2 8 3 7 -T 1 1 2 D 2 1 2A A C C DDC_WP PC_HS PC_AUD_L +5V_MULTI DSUB_SCL PC_R CDS3C30GTH 30V D202 CDS3C30GTH 30V D203 ADUC30S03010L_AMODIODE 30V D200 ADUC30S03010L_AMODIODE 30V D201 30V D206 30V D205 ADUC30S03010L_AMODIODE 30V D204 ADUC30S03010L_AMODIODE 30V D209 30V D208 READY 30V D207 READY USB_DL_N USB_DL_P 0 REAR_USB R229 0 REAR_USB R230 U S B D O W N S T R E A M U B 0 1 1 2 3 -4 H H S -4 F JK205 REAR_USB 1 2 3 4 5 0 .1uF C203 0.1uF C200 0.1uF C201 0.1uF C202 0.01uF C205 0.1uF C204 0.1uF C206 0.1uF C207 100R202 100R203 75 R227 220K R223 READY 220K R222 READY 12K R226 12K R228 75 R211 75 R212 75 R213 4.7K R214 4.7K R215 220K R231 220K R232 10K R233 10K R234 12K R235 12K R236 4.7K R220 4.7K R221 100 R216 100 R217 100 R218 0.1uF OCP_READY C208 MIC2009YM6-TR OCP_READYIC202 3ENABLE 2GND 4 FAULT/ 1VIN6 VOUT 5 ILIMIT 10uF OCP_READY C209 120OHM OCP_READY L200 +5V_USB 1K OCP_READY R209 4.7K OCP_READY R210 0 Non_OCP R237 10uF6.3VC210USB_DL_N USB_DL_P 68 R207 68 R208 68pF C213 68pF C211 4.7K R219 READY 0 R200 0 R201 500L201 220uF 16VC212 100uF 16VC214 KDS226 D213 OCP_READY AAC C 510 OCP_READY R238 160 OCP_READY R206 10KR224 10KR225 IR_OUT USB I t ’ s p o s s i b e l t o 2 7 ~ 4 7 o h m ** 1A Des ign SIDE AV RS-232C (CI ITEM) PC EDID PC PC SOUND P i n t o P i n w i t h EAN43439401 Close to SIDE_USB THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. C opyright LG E lectronics. Inc. A ll right reserved. O nly for training and service purposes LG E Internal U se O nly IN P U T 2 TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4- 47pF C403 22 IR-OUT R430 470pF C404 NON_19_22_26" KEY1 ZD401 120ohmL406 NON_19_22_26" ZD402 +5VST_MST ZD400 500-ohmL410 NON_19_22_26" IR_OUT +3.3V_MULTI_MST 10K IR-OUT R429 2SC3052 Q405 IR-OUT E B C 500-ohmL411 NON_19_22_26" SUB_SCL 120ohmL402 KEY2 2SC3052 Q404 IR-OUTE B C +5VST_MST IR SUB_SDA 0.1uF C408 NON_19_22_26" +3.3V_MST +5VST_MST 0.1uF C411 NON_19_22_26" 470pF C412 NON_19_22_26" 120ohmL403 NON_19_22_26" +3.3V_MULTI_MST +3.3V_MULTI_MST +5V_+12V_LCD 0.1uFC407 READY 47uF 16V C406 0.1uF 16VC414 NON_19_22_26" +3.3V_MST KEY2 100pF 50V C401 19_22_26" KEY1 100pF 50V C40019_22_26" +5V_+12V_LCD TXCE0+,TXCE0-,TXCE1+,TXCE1-,TXCE2+,TXCE2-,TXCE3+,TXCE3-,TXCE4+,TXCE4-,TXCLKE+,TXCLKE-,TXCLKO+,TXCLKO-,TXCO0+,TXCO0-,TXCO1+,TXCO1-,TXCO2+,TXCO2-,TXCO3+,TXCO3-,TXCO4+,TXCO4- +5V_+12V_LCD +3.3V_MULTI_MST OPC_EN E-DIM OPC_OUT 100pF 50V C405 19_22_26" SUB_SCL 100pF 50V C402 19_22_26" 12507WS-12L P400 NON_19_22_26" 1 SCL 2 SDA 3 GND 4 KEY1 5 KEY2 6 5V_ST 7 GND 8 WARM_ST(LED_R_BIG) 9 IR 10 GND 11 ST_3.3V(LED_B) 12 POWER_ON(LED_R_SMALL) 13 . P405 19_22_26" 1 KEY1 2 KEY2 3 GND 4 5V_ST 5 GND 6 IR 7 LED_B 8 LED_R 9 . BG1608B121F L400 19_22_26" BG1608B121F L401 19_22_26" BG1608B121F L408 19_22_26" BG1608B121F L405 19_22_26" 4.7K R420 4.7K R421 10K IR-OUT R427 10K IR-OUT R428 47K IR-OUT R426 0 R417 NON_19_22_26" 0R400 READY 0 R403 NON_19_22_26" 0R413 READY 0 R402 8B IT o r 52 sha rp 4.7K 10BIT R401 4.7K JEIDA R407 0 R424 VESA100R409 READY 0 READY R405 0 OPC_ENABLE R412 470 R435 OPC_ENABLE SMAW200-03 P404 19_22_26" 1 KEY1 2 KEY2 3 GND 120-ohm L404 120-ohmL407 NON_19_22_26" TF05-51S P401 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 FF10001-30 P402 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 SMW200-28C P403 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 LED_R +3.3V_MST RT1C3904-T112 Q400 OPC_ENABLE E BC 1K R411 OPC_ENABLE 10K R404 19_22_26" 2SC3052 Q401 19_22_26" E B C +3.3V_MULTI_MST 10KR410 19_22_26" 10K R414 19_22_26" 2SC3052 Q402 19_22_26" E B C +3.3V_MST 10KR415 19_22_26" 4.7K R406 19_22_26" 0 READY R416 0 READY R418 0 NON 22/27" FHD R419 0 NON 22/27" FHD R422 0 NON 22/27" FHD R423 0 NON 22/27" FHD R431 0 NON 22/27" FHD R425 TXCO3+ TXCE1+ TXCO1+ TXCE1- TXCLKO+ TXCO2- TXCO2+ TXCO1- TXCE2+ TXCE2- TXCLKE+ TXCLKE- TXCE3+ TXCE3- TXCE4+ TXCE4- TXCO3- TXCO4+ TXCO4- TXCLKO- TXCE2- TXCE2+ TXCE1- TXCE1+ TXCE0- TXCE0+ TXCLKE+ TXCLKE- TXCE3+ TXCE3- TXCE3- TXCE3+ TXCLKE- TXCLKE+ TXCE2- TXCE2+ TXCE1- TXCE1+ TXCE0- TXCE0+ TXCE0- TXCE0+ TXCO0+ TXCO0- FHD X R402 4.7K10BIT(FHD) X 8BIT(HD) X X 0 X 3 2 s h a r p R401 0 0 X 5 2 s h a r p 8BIT(FHD) CONTROL KEY OPC_EABLE OPC_OUTPUT External VBR PANEL WAFER IR(19/22/26") (19/22/26") HD(19/22") IR(Non 19/22/26) CONTROL KEY(Non 19/22/26) *8BIT(FHD):22/27" HD(26/32/37/42/47") THE SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X-RADIATION. FILRE AND ELECTRICAL SHOCK HAZARDS, WHEN SERVICING IF IS ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR THE CRITICAL COMPONENTS IN THE SYMBOL MARK OF THE SCHEMETIC. C opyright LG E lectronics. Inc. A ll right reserved. O nly for training and service purposes LG E Internal U se O nly LV D S / C T R K E Y Feb., 2009 Printed in KoreaP/NO : MFL60021514 #EV#
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